Abstract: A mechanical and electrical interconnection of an active integrated circuit to a passive substrate. The interconnection includes a contact retainer having resilient elements disposed in apertures which extend through the retainer so that the elements are radially compressed. The retainer is disposed between the active integrated circuit and the passive substrate. The retainer may be secured either mechanically or through bonding agents to the active integrating circuit and the passive substrate. Axial compression of the resilient elements upon disposing the retainer between the active integrated circuit and the passive substrate provides for wiping action of the resilient elements on the contacts of the active integrated circuit and the passive substrate. The contact retainer may include thermal paths for heat dissipation of the integrated circuits to accommodate a higher density of integrated circuits.