Abstract: A device configured to sense a touch on a surface of the device. The device includes a cover and a force-sensing structure disposed below the cover. The force-sensing structure may be positioned below a display and used in combination with other force-sensing elements to estimate the force of a touch on the cover of a device.

Abstract: An optical force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Abstract: An optically transparent force sensor, which may be used as input to an electronic device. The optically transparent force sensor may be configured to compensate for variations in temperature using two or more force-sensitive components that are formed from materials having different temperature- and strain-dependent responses.

Abstract: An optically transparent force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Abstract: An optically transparent force sensor, which may be used as input to an electronic device. The optically transparent force sensor may be configured to compensate for variations in temperature using two or more force-sensitive components that are formed from materials having different temperature- and strain-dependent responses.

Abstract: Systems, methods, and computer-readable media for transmitting data using invisible light via a display assembly of an electronic device are provided. This may enable more data to be transmitted simultaneously via a single display assembly of a limited size. For example, a single display assembly may simultaneously transmit a first type of data using visible light that may be comprehensible to a user (e.g., textual information that may be legible to a human) as well as a second type of data using invisible light that may be machine-readable (e.g., a barcode that may be detected by a scanner device but that may not be seen by a human).

Abstract: An optically transparent force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Abstract: Systems and methods are provided for synchronizing educational multimedia content objects between a server system and a plurality of remote mobile communication devices over a network. An educational multimedia repository stores the educational multimedia content objects and makes the educational multimedia content objects accessible to software components operating within the educational multimedia system. The system downloads to one of the remote communication devices one or more of the educational multimedia content objects from the repository while the one of the remote communication devices has a data connection with the computer server system.

Abstract: A semiconductor apparatus has one or more semiconductor chips. The semiconductor apparatus may include a power supply pad; power lines disposed on one side of the power supply pad, and including a first power line and a second power line; and connection lines connecting the power supply pad and the power lines. The connection lines may include a plurality of first connection lines connecting the power supply pad and the first power line, and a plurality of second connection lines connecting the power supply pad and the second power line, and disposed between the first connection lines. One or more pair of adjacent first connection lines may have a connection part by which the pair of adjacent first connection lines are connected with each other.

Abstract: A semiconductor apparatus has one or more semiconductor chips. The semiconductor apparatus may include a power supply pad; power lines disposed on one side of the power supply pad, and including a first power line and a second power line; and connection lines connecting the power supply pad and the power lines. The connection lines may include a plurality of first connection lines connecting the power supply pad and the first power line, and a plurality of second connection lines connecting the power supply pad and the second power line, and disposed between the first connection lines. One or more pair of adjacent first connection lines may have a connection part by which the pair of adjacent first connection lines are connected with each other.

Abstract: An optically transparent force sensor element is compensated for effects of environment by comparing a force reading from a first force-sensitive component with a second force-sensitive components. The first and second force-sensitive components disposed on opposite sides of a flexible substrate within a display stack.

Abstract: An optically transparent force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Abstract: An optically transparent force sensor, which may be used as input to an electronic device. The optically transparent force sensor may be configured to compensate for variations in temperature using two or more force-sensitive components that are formed from materials having different temperature- and strain-dependent responses.

Abstract: A device configured to sense a touch on a surface of the device. The device includes a cover and a force-sensing structure disposed below the cover. The force-sensing structure may be positioned below a display and used in combination with other force-sensing elements to estimate the force of a touch on the cover of a device.

Abstract: A semiconductor apparatus has one or more semiconductor chips. The semiconductor apparatus may include a power supply pad; power lines disposed on one side of the power supply pad, and including a first power line and a second power line; and connection lines connecting the power supply pad and the power lines. The connection lines may include a plurality of first connection lines connecting the power supply pad and the first power line, and a plurality of second connection lines connecting the power supply pad and the second power line, and disposed between the first connection lines. One or more pair of adjacent first connection lines may have a connection part by which the pair of adjacent first connection lines are connected with each other.

Abstract: A device configured to sense a touch on a surface of the device. The device includes a cover and a force-sensing structure disposed below the cover. The force-sensing structure may be positioned below a display and used in combination with other force-sensing elements to estimate the force of a touch on the cover of a device.

Abstract: An optically transparent force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Abstract: An object can depress an input device, such as, for example, a function button in an electronic device. A resistive element having a mechanically resistive force can be disposed to resist the depression or movement of the input device. One or more electrodes can be disposed to provide a measure of capacitance based on the depression of the input device. A shield can be disposed to reduce the parasitic capacitance between the one or more electrodes and the object. The electronic device can include a fingerprint sensor operably connected to at least one of the one or more electrodes.

Abstract: A semiconductor device may include a global line coupled to a source, and a plurality of local lines coupled to a plurality of targets, respectively, and coupled to the global line. The local lines may be configured to have cross-sectional areas. The cross-sectional areas may increase in proportion to distances from the source to the respective targets.

Abstract: A test probe system including a test probe structure. The test probe system may include the test probe structure including a probe support, and a conductive, conformable component coupled to the probe support. The conductive, conformable component may be configured to: directly contact a test surface of a test structure, or couple a conductive element to the probe support. The conductive element may directly contact the test surface of the test structure. The test probe system may also include a conductive liquid dispensing system coupled to the test probe structure. The conductive liquid dispensing system may be configured to supply a conductive liquid to the test surface of the test structure.