Patents by Inventor John Christopher Camp

John Christopher Camp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate
    Patent number: 6544584
    Abstract: A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g.
    Type: Grant
    Filed: March 7, 1997
    Date of Patent: April 8, 2003
    Assignee: International Business Machines Corporation
    Inventors: Edward Lee Arrington, John Christopher Camp, Robert Jeffrey Day, Edmond Otto Fey, Curtis Michael Gunther, Thomas Richard Miller
  • Method of surface finishes for eliminating surface irregularities and defects
    Patent number: 6093335
    Abstract: A method for planarizing an exposed metal surface on a substrate is provided in which surface irregularities are eliminated. A photoresist layer is first removed from the substrate. Then a conformal planarizing head is placed in contact with the metal surface while chemical etchant essentially free of abrasives is supplied to an interface between the metal substrate and the planarizing head. The surface is then planarized until it is free of irregularties.
    Type: Grant
    Filed: November 20, 1997
    Date of Patent: July 25, 2000
    Assignee: International Business Machines Corporation
    Inventors: Ashwinkumar C. Bhatt, John Christopher Camp, Subahu Dhirubhai Desai, Voya Rista Markovich, Michael Wozniak
  • Process for removal of undersirable conductive material on a circuitized substrate and resultant circuitized substrate
    Patent number: 6063481
    Abstract: A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: May 16, 2000
    Assignee: International Business Machines Corporation
    Inventors: Edward Lee Arrington, John Christopher Camp, Robert Jeffrey Day, Edmond Otto Fey, Curtis Michael Gunther, Thomas Richard Miller