Patents by Inventor John Christopher Flake

John Christopher Flake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating apparatus and four mask TFT array process with electroplated metal
    Patent number: 7001498
    Abstract: An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: February 21, 2006
    Assignee: International Business Machines Corporation
    Inventors: Evan George Colgan, John Christopher Flake, Lubomyr Taras Romankiw, Robert Luke Wisnieff
  • Method of forming patterned nickel and doped nickel films via microcontact printing and uses thereof
    Patent number: 6866791
    Abstract: The process of derivatization and patterning of surfaces, and more particularly to the formation of self-assembled molecular monolayers on metal oxide surfaces using microcontact printing and the derivative articles produced thereby.
    Type: Grant
    Filed: May 2, 2000
    Date of Patent: March 15, 2005
    Assignee: International Business Machines Corporation
    Inventors: Tricia L. Breen, Peter M. Fryer, Robert L. Wisnieff, John Christopher Flake
  • Electroplating apparatus and four mask TFT array process with electroplated metal
    Publication number: 20030038037
    Abstract: An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.
    Type: Application
    Filed: October 10, 2002
    Publication date: February 27, 2003
    Applicant: International Business Machines Corporation
    Inventors: Evan George Colgan, John Christopher Flake, Lubomyr Taras Romankiw, Robert Luke Wisnieff
  • Electroplating apparatus
    Patent number: 6495005
    Abstract: An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: December 17, 2002
    Assignee: International Business Machines Corporation
    Inventors: Evan George Colgan, John Christopher Flake, Lubomyr Taras Romankiw, Robert Luke Wisnieff