Patents by Inventor John Christopher Osborne

John Christopher Osborne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240391189
    Abstract: Co-curable and co-cured UV/visible light-resistant composite material assembly precursors used to make composite material assemblies comprise a compatible co-curable and co-cured peel ply protective layer to impart selected surface characteristics to the co-curable and co-cured composite material assembly precursor prior to peel ply removal and composite material precursor incorporation into a larger assembly are disclosed.
    Type: Application
    Filed: November 6, 2023
    Publication date: November 28, 2024
    Inventors: Benjamin Zhang Lam, Melinda Dae Miller, John Christopher Osborne, Bryan Joseph Withrow, Jason Russell Grindon, Jason Alan Bolles, Patrice Kathryn Ackerman, John Raymond Aubin, Kevin Lee Braun
  • Patent number: 9347868
    Abstract: Adhesion testing systems, methods of fabrication, and methods of testing are disclosed. Test systems include test coupons with non-metallic test adherends. Test coupons are configured to test bonds to the non-metallic test adherends under peeling stress and/or shearing stress. Test methods are simplified and rapid as compared to standard adhesion tests and include methods of accelerated environmental testing. Test methods also are adapted for qualitative and quantitative measurement of bond performance.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: May 24, 2016
    Assignee: The Boeing Company
    Inventors: Peter J. Van Voast, Kay Youngdahl Blohowiak, John Christopher Osborne, Marcus Anthony Belcher
  • Publication number: 20140326074
    Abstract: Adhesion testing systems, methods of fabrication, and methods of testing are disclosed. Test systems include test coupons with non-metallic test adherends. Test coupons are configured to test bonds to the non-metallic test adherends under peeling stress and/or shearing stress. Test methods are simplified and rapid as compared to standard adhesion tests and include methods of accelerated environmental testing. Test methods also are adapted for qualitative and quantitative measurement of bond performance.
    Type: Application
    Filed: December 11, 2013
    Publication date: November 6, 2014
    Applicant: The Boeing Company
    Inventors: Peter J. Van Voast, Kay Youngdahl Blohowiak, John Christopher Osborne, Marcus Anthony Belcher