Patents by Inventor John Chunpo Lu

John Chunpo Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microcellular thermoplastic thin films formed by a solid-state foaming process
    Patent number: 9381723
    Abstract: Cellular thin films include a first side separated from a second side, the separation of which defines the thickness of the thin film; at least one layer of a polymeric material arranged along the thickness of the thin film, wherein the polymeric material includes cells and the first and second sides of the thin film have exterior surfaces that have substantially the same thickness as the interior walls forming the cells. The surfaces of the thin films have bumps caused by the cells. The thin exterior surfaces of the thin films is advantageous to allow the films to be flexible.
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: July 5, 2016
    Assignee: University of Washington
    Inventors: Vipin Kumar, John Chunpo Lu, Henry G. Schirmer, Dustin Miller
  • MICROCELLULAR THERMOPLASTIC THIN FILMS FORMED BY A SOLID-STATE FOAMING PROCESS
    Publication number: 20100297416
    Abstract: Cellular thin films include a first side separated from a second side, the separation of which defines the thickness of the thin film; at least one layer of a polymeric material arranged along the thickness of the thin film, wherein the polymeric material includes cells and the first and second sides of the thin film have exterior surfaces that have substantially the same thickness as the interior walls forming the cells. The surfaces of the thin films have bumps caused by the cells. The thin exterior surfaces of the thin films is advantageous to allow the films to be flexible.
    Type: Application
    Filed: September 12, 2008
    Publication date: November 25, 2010
    Applicant: UNIVERSITY OF WASHINGTON
    Inventors: Vipin Kumar, John Chunpo Lu, Henry G. Schirmer, Dustin Miller