Abstract: The design methods described enable three-dimensional integrated circuit systems in which all of the dies, in a vertically bonded stack of dies, are identical. Only one mask set and wafer type is required since a single circuit design is produced for one die in the stack and reused for all the dies with little or no modification. The system scales directly as the level of stacking is increased while incurring no extra design effort, beyond that required for the initial design.

Abstract: A circuit and method for accelerating bus line communication in an integrated circuit is disclosed. High speed transmission of signals along a bus line is achieved by driving a series of bus line segments with their own bi-directional bus amplification circuits. Because each bus line segment has less capacitive loading than longer non-segmented bus lines, voltage reversal, or data inversion of a pair of complementary lines of a bus line segment is accomplished at high speed. Each bi-directional bus amplification circuit includes a precharge circuit for precharging each complementary pair of lines to known logic levels, and a drive circuit for changing the logic level of each line.

Abstract: A column redundancy architecture for arrayed parallel processor devices is disclosed. In particular, daisy chained communication between processing elements is preserved after defective memory columns and their associated processing elements are disabled, by setting a bypass circuit within the processing element to be disabled. An address remapping circuit ensures that spare memory columns and associated processing elements replacing the defective memory columns and processing elements can be addressed in a linear column order. The column redundancy architecture is flexible as it permits replacement of arbitrary numbers of series adjacent processing elements as well as non adjacent processing elements with a minimal impact on device performance.

Abstract: A column redundancy architecture for arrayed parallel processor devices is disclosed. In particular, daisy chained communication between processing elements is preserved after defective memory columns and their associated processing elements are disabled, by setting a bypass circuit within the processing element to be disabled. An address remapping circuit ensures that spare memory columns and associated processing elements replacing the defective memory columns and processing elements can be addressed in a linear column order. The column redundancy architecture is flexible as it permits replacement of arbitrary numbers of series adjacent processing elements as well as non adjacent processing elements with a minimal impact on device performance.

Abstract: The design methods described enable three-dimensional integrated circuit systems in which all of the dies, in a vertically bonded stack of dies, are identical. Only one mask set and wafer type is required since a single circuit design is produced for one die in the stack and reused for all the dies with little or no modification. The system scales directly as the level of stacking is increased while incurring no extra design effort, beyond that required for the initial design.

Abstract: A circuit and method for accelerating bus line communication in an integrated circuit is disclosed. High speed transmission of signals along a bus line is achieved by driving a series of bus line segments with their own bi-directional bus amplification circuits. Because each bus line segment has less capacitive loading than longer non-segmented bus lines, voltage reversal, or data inversion of a pair of complementary lines of a bus line segment is accomplished at high speed. Each bi-directional bus amplification circuit includes a precharge circuit for precharging each complementary pair of lines to known logic levels, and a drive circuit for changing the logic level of each line.