Patents by Inventor John Conrad Kutt

John Conrad Kutt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • C4 Pb/Sn evaporation process
    Patent number: 5776790
    Abstract: A process of Pb/Sn evaporation eliminates haloes in the manufacture of solder bump interconnects. This robust process of forms solder bump interconnects and reduces critical molebdnum mask sensitivity. Vacuum evaporation through which Pb/Sn C4 pads are deposited is performed by maintaining parallel temperature gradients between the molybdenum mask and silicon wafer, thus resulting in elimination of connecting haloes and yield losses.
    Type: Grant
    Filed: February 28, 1996
    Date of Patent: July 7, 1998
    Assignee: International Business Machines Corporation
    Inventors: Stephen George Starr, John Conrad Kutt, Robert Henry Zalokar, Jr.