Patents by Inventor John D. Borneman

John D. Borneman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of soldering a leaded circuit component
    Patent number: 6609651
    Abstract: A two-part solder preform for use in attaching a leaded circuit component to a circuit board. The preform is formed by two different solid components, a first of which is formed of a lower-temperature solder alloy and the second of a higher-temperature solder alloy, in which the first solid component is present in a sufficient amount to dissolve the second solid component when the preform is heated above the melting temperature of the lower-temperature solder alloy but below the melting temperature of the higher-temperature solder alloy. Upon cooling, the preform yields a solder joint having a substantially homogenous composition, which bonds the lead to the circuit board. Preferred solder alloys for the first and second solid components are lead-free.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: August 26, 2003
    Assignee: Delphi Technologies, Inc
    Inventor: John D. Borneman