Patents by Inventor John D. Harper

John D. Harper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NETWORK CONFIGURATION USING CONFIGURATION PARAMETER INHERITANCE
    Publication number: 20080086545
    Abstract: In a network, a hierarchy of network element classes is identified in which members of a network element class share common configuration parameters. A sub-class of a network element class inherits configuration parameters from the parent network element class. At least part of the hierarchy of network element classes is presented on a computer display to facilitate navigation and management of configuration parameters. Management of configuration parameters may include editing configuration parameters of existing network elements, generating reports of configuration parameters and configuring new network elements.
    Type: Application
    Filed: August 16, 2006
    Publication date: April 10, 2008
    Applicant: MOTOROLA, INC.
    Inventors: GARY P. FATT, JOHN D. HARPER
  • Network manager and method thereof for a communication system
    Patent number: 6301266
    Abstract: A method of managing objects residing in a communication system includes the steps of reading (201), by a network manager for a plurality of objects represented by at least one agent and residing in a communication system, a mapping of bitmap types to object types and monitoring (203) at least one communication resource between the network manager and the at least one agent. After service interruption on one communication resource of the at least one communication resource, and upon detecting (207) a return to service of the one communication resource, the network manager reads at least one bitmap from the at least one agent, wherein the at least one bitmap represents information relating to at least one object of the plurality of objects, and interpreting (213) the at least one bitmap by utilizing the mapping of bitmap types to object types in order to determine a status of the at least one object of the plurality of objects.
    Type: Grant
    Filed: February 10, 1999
    Date of Patent: October 9, 2001
    Assignee: Motorola, Inc.
    Inventors: Larry M. Peterson, Vijay Agarwal, Eliza Ballew, Kristin Cramer, Lana Dubinsky, John D. Harper, Brad Karch, Randall G. Kremske, Steven A. Matz
  • Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct
    Patent number: 5962586
    Abstract: Improved toughened epoxy resin systems having glass transition temperatures of 250.degree. C. to 350.degree. C. are prepared by carefully curing a blend of epoxy resin or resins, all of which have an epoxy functionality of at least 2 with the mixture having an epoxy functionality greater than 2, an anhydride hardener mixture comprising a bicycloalkenedicarboxylic acid anhydride, a polybutadiene-maleic anhydride adduct, and optionally, a polybutadiene, a bismaleimide, or benzophenone tetracarboxylic acid dianhydride, preferably using a dialkyl imidazole-2-thione accelerator.
    Type: Grant
    Filed: September 27, 1994
    Date of Patent: October 5, 1999
    Inventor: John D. Harper
  • Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct
    Patent number: 5629379
    Abstract: Toughened epoxy resin systems having high temperature capabilities of from 250.degree. to 350.degree. C. prepared by carefully curing blends of epoxy resins having an average epoxy functionality greater than two with bicycloalkene dicarboxylic anhydride hardener, maleinized polybutadiene toughening agent, supplemental hardener selected from the group consisting of aromatic tetracarboxylic dianhydrides and bismaelimides of aromatic diamines, and epoxy/anhydride accelerator.
    Type: Grant
    Filed: October 6, 1995
    Date of Patent: May 13, 1997
    Inventor: John D. Harper
  • Thermosetting bis(isoimide) resin compositions
    Patent number: 5082920
    Abstract: Improvements in the thermal stability of bis(isoimide) resins are achieved by the addition of small amounts of trihydroxyaromatic or polyhydroxyaromatic compounds to the partially polymerized bis(isoimide) resin composition.
    Type: Grant
    Filed: September 24, 1990
    Date of Patent: January 21, 1992
    Inventor: John D. Harper
  • Thermosetting bis(isoimide) resin composition
    Patent number: 5079338
    Abstract: An improvement in thermosetting bis(isoimide) resin compositions is achieved by replacing a small part of the unsaturated carboxylic acid anhydride starting material with a stoichiometrically equivalent amount of a poly(diolefin)-unsaturated carboxylic acid anhydride adduct.
    Type: Grant
    Filed: October 15, 1990
    Date of Patent: January 7, 1992
    Inventors: Thomas A. Schenach, John D. Harper
  • Thermosetting bis(isoimide)-diphenol resin
    Patent number: 4732963
    Abstract: Thermosetting bis(isoimide) resins are prepared by the reaction of an ethylenically unsaturated bis(isoimide) with a dihydric phenol.
    Type: Grant
    Filed: February 6, 1987
    Date of Patent: March 22, 1988
    Inventors: Robert L. Wank, John D. Harper