Patents by Inventor John D. Hoang

John D. Hoang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-density interconnect technique
    Patent number: 5429510
    Abstract: A high density interconnect system (30) employs contact fingers (32) on both surfaces (34) and (36) of burn-in PCB (38), feed-through PCB (40) and driver PCB (42). Each of the PCBs (38), (40) and (42) has a card-edge connector (44), (46) and (48). The feed-through PCB (40) has a second card-edge connector (40) and a second set of contact fingers (32), since it mates with both the burn-in PCB (38) and the driver PCB (42). The contact fingers (32) and the card-edge connectors (44), (46), (48) and (50) of each PCB (38), (40) and (42) mate inversely with each other on adjacent PCBs, i.e., the card-edge connector (44) of the burn-in PCB (38) mates with the contact fingers (32) of the feed-through PCB (40), and the card-edge connector (46) of the feed-through PCB (40) mates with the contact fingers (32) of the burn-in PCB (38), for example.
    Type: Grant
    Filed: December 1, 1993
    Date of Patent: July 4, 1995
    Assignee: Aehr Test Systems, Inc.
    Inventors: William D. Barraclough, Mikhail A. Alperin, Jeffrey A. Brehm, John D. Hoang, Patrick M. Shepherd, James F. Tomic