Abstract: A pressure-sensitive adhesive tape for masking selected areas of an article such as a printed circuit board during high temperature operations such as wave soldering comprises a polymeric film coated with a layer of pressure-sensitive adhesive, both film and adhesive being resistant to temperatures up to 250.degree. C. for up to 5 seconds and being soluble in a fluorocarbon solvent such as a trichlorotrifluoroethane solvent. More particularly the film and adhesive are resistant to temperatures up to 260.degree. C. for up to 25 seconds.The polymeric film, which is a novel self-supporting film, may suitably comprise a polymethacrylate other than poly(methyl methacrylate) e.g. poly(butyl methacrylate), or ethyl cellulose or polyvinylpyrrolidone.