Patents by Inventor John D. Molnar

John D. Molnar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957893
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: April 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde, David A. Dinsmoor, Duane L. Bourget, Forrest C M Pape, Gabriela C. Molnar, Joel A. Anderson, Michael J. Ebert, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Timothy J. Denison, Todd V. Smith
  • Patent number: 11957894
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: April 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Anthony M. Chasensky, Bernard Q. Li, Brad C. Tischendorf, Chris J. Paidosh, Christian S. Nielsen, Craig L. Schmidt, David A. Dinsmoor, Duane L. Bourget, Eric H. Bonde, Erik R. Scott, Forrest C M Pape, Gabriela C. Molnar, Gordon O. Munns, Joel A. Anderson, John E. Kast, Joseph J. Viavattine, Markus W. Reiterer, Michael J. Ebert, Phillip C. Falkner, Prabhakar A. Tamirisa, Randy S. Roles, Reginald D. Robinson, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Thomas P. Miltich, Timothy J. Denison, Todd V. Smith, Xuan K. Wei
  • Patent number: 9016107
    Abstract: A method of calibrating a voltage for use with an ultrasonic transducer of a wire bonding machine in a constant voltage mode is provided. The method includes: (1) determining an impedance value associated with operation of the ultrasonic transducer; and (2) establishing an adjusted voltage level for use with the ultrasonic transducer in the constant voltage mode based on the determined impedance value.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: April 28, 2015
    Assignee: Kulicke & Soffa Industries, Inc.
    Inventors: Ivy Wei Qin, John D. Molnar, Thomas J. Colosimo, Jr.
  • Publication number: 20110056267
    Abstract: A method of calibrating a voltage for use with an ultrasonic transducer of a wire bonding machine in a constant voltage mode is provided. The method includes: (1) determining an impedance value associated with operation of the ultrasonic transducer; and (2) establishing an adjusted voltage level for use with the ultrasonic transducer in the constant voltage mode based on the determined impedance value.
    Type: Application
    Filed: December 21, 2007
    Publication date: March 10, 2011
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Ivy Wei Qin, John D. Molnar, Thomas J. Colosimo
  • Patent number: 5473122
    Abstract: A passive damping mechanism for a panel member in which a bonding layer is disposed on each side of the panel, a damping layer is disposed on each of the two bonding layers, and a constraining layer is disposed on each of the two damping layers. Each of the above-mentioned layers is coextensive with the respective panel surfaces to which it is attached. The bonding layers are preferably made of an aramid fiber material. The damping layers are preferably made of a viscoelastic material. The constraining layers are preferably made of an aluminum-graphite metal matrix composite material. In addition, the coefficient of thermal expansion of each bonding layer should match well with that of each constraining layer.
    Type: Grant
    Filed: January 4, 1993
    Date of Patent: December 5, 1995
    Assignee: Martin Marietta Corporation
    Inventors: Srinivas Kodiyalam, Clyde V. Stahle, Jr., Dennis H. Hill, John D. Molnar, John A. Chionchio