Patents by Inventor John D. Pace

John D. Pace has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip selection in automatic assembly of integrated circuit
    Patent number: 4759675
    Abstract: An apparatus for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and then knocks a die down from the array of dice into a receptacle for transport to further processing stages.
    Type: Grant
    Filed: October 27, 1986
    Date of Patent: July 26, 1988
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventors: Robert H. Bond, Steven Swendrowski, Michael A. Olla, Barry L. Morrison, Ricky Parkinson, Linn Garrison, John D. Pace
  • Chip selection in automatic assembly of integrated circuit
    Patent number: 4627787
    Abstract: A method for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and the knocks a die down from the array of dice into a receptacle for transport to further processing stages.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: December 9, 1986
    Assignee: Thomson Components-Mostek Corporation
    Inventors: Robert H. Bond, Steven Swendrowski, Michael A. Olla, Barry L. Morrison, Ricky Parkinson, Linn Garrison, John D. Pace