Patents by Inventor John D. Schwarzkopf

John D. Schwarzkopf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7992626
    Abstract: A combination spray and cold plate thermal management system for effectively thermally managing a heat producing device during startup. The combination spray and cold plate thermal management system includes a spray unit thermally managing a heat producing device and a coolant reservoir thermally connected to the heat producing device. The coolant reservoir includes a porous media with coolant channels for storing a volume of the waste coolant after spraying of coolant has terminated. The coolant reservoir is fluidly connected to the spray chamber within the spray unit to receive the waste coolant.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: August 9, 2011
    Assignee: Parker-Hannifin Corporation
    Inventors: Charles L. Tilton, Donald E. Tilton, Thomas D. Weir, John D. Schwarzkopf
  • Patent number: 7392660
    Abstract: A spray cooling system for transverse evaporative spray cooling in a narrow gap, which may generally include a mixing zone, a converging zone, a plurality of cooling conduits, and a re-circulation conduit. The spray cooling system in some of its embodiments, provides, among other things, a feed system for narrow gap evaporative spray cooling, a method for reducing the pressure gradient across the surface from which heat is to be transferred and a housing system which utilizes a baffle to separate the plurality of cooling conduits from a re-circulation conduit and to re-circulate vapor to the entry of the cooling conduit.
    Type: Grant
    Filed: September 6, 2005
    Date of Patent: July 1, 2008
    Assignee: Isothermal Systems Research, Inc.
    Inventors: Charles L. Tilton, John D. Schwarzkopf
  • Publication number: 20080066889
    Abstract: The present invention is a two-phase liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled through evaporation. The resulting liquid and vapor mixture exits the spray modules via return branches. Each individual return branch feeds into a return manifold wherein the manifold is sized sufficiently for the separation of liquid and vapor under the influences of gravity. In addition, a heat exchanger is located within the return manifold and provides for the condensation of vapor. The heat exchanger may also provide liquid subcooling.
    Type: Application
    Filed: March 31, 2004
    Publication date: March 20, 2008
    Applicant: Isothermal Systems Research
    Inventors: Paul A. Knight, John D. Schwarzkopf, Charles L. Tilton