Abstract: Methods, systems and devices for protecting partially processed electronic parts, are disclosed. In some embodiments, a method for protecting electronic parts includes applying a first protective sheet on one or more partially-processed semiconductor devices, removing the first protective sheet, and performing a semiconductor-processing operation on the one or more partially-processed semiconductor devices. In some embodiments, a semiconductor processing system for protecting electronic parts includes one or more partially-processed semiconductor devices, and a first protective sheet applied on the one or more partially-processed semiconductor devices, the first protective sheet being subsequently removed, and a semiconductor-processing operation being performed on the one or more partially-processed semiconductor devices.

Abstract: A method is described comprising the combined administration of a novel composition comprising serum complement proteins with complement-fixing antibodies to induce transient disruption of myelin and/or demyelination. The antibodies specifically bind to one or more epitopes of myelin, and complement proteins. A method is also described for promoting regrowth, repair, and regeneration of neurons in a mammalian subject. The methods can be used following immediate or chronic injury.

Abstract: Novel compositions are described comprising the combined administration of serum complement proteins with complement-fixing antibodies. The antibodies specifically bind to one or more epitopes of myelin, and complement proteins. These compositions are useful for promoting regrowth, repair, and regeneration of neurons in the CNS of a mammalian subject. The compositions and method can be used following immediate or chronic injury.