Patents by Inventor John D. WATKINS

John D. WATKINS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132527
    Abstract: The present disclosure relates generally to certain compounds, pharmaceutical compositions comprising said compounds, and methods of making and using said compounds and pharmaceutical compositions. The compounds and compositions provided herein may be used for the treatment or prevention of a Retroviridae infection, including an HIV infection.
    Type: Application
    Filed: August 22, 2023
    Publication date: April 25, 2024
    Inventors: Julie Farand, Michael Graupe, Tezcan Guney, Darryl Kato, Jiayao Li, John O. Link, James B. C. Mack, Dong Min Mun, Roland D. Saito, William J. Watkins, Jennifer R. Zhang
  • Publication number: 20220127744
    Abstract: Methods and compositions for improving adhesion of an organic coating applied to a surface of a conductive substrate are provided. In aspects described, at least one reactive metal-based deposit is electrodeposited on a conductive substrate by pulse electrochemical reduction of a metal complex using a pulse scheme, wherein the metal complex is dissolved in a substantially aqueous medium.
    Type: Application
    Filed: February 3, 2020
    Publication date: April 28, 2022
    Inventors: John D. WATKINS, Hunaid B. NULWALA
  • Patent number: 11111591
    Abstract: Methods and compositions for electrodepositing mixed metal reactive metal layers by combining reactive metal complexes with electron withdrawing agents are provided. Modifying the ratio of one reactive metal complex to the other and varying the current density can be used to vary the morphology the metal layer on the substrate.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: September 7, 2021
    Assignee: LUMISHIELD TECHNOLOGIES INCORPORATED
    Inventors: Hunaid B. Nulwala, John D. Watkins
  • Publication number: 20190256994
    Abstract: The disclosure relates to a method for the electrodeposition of at least one metal onto a surface of a conductive substrate. In some embodiments, the electrodeposition is conducted at a temperature from about 10° C. to about 70° C., about 0.5 atm to about 5 atm, in an atmosphere comprising oxygen. In some embodiments, the method comprises electrodepositing the at least one metal via electrochemical reduction of a metal complex dissolved in a substantially aqueous medium.
    Type: Application
    Filed: February 16, 2016
    Publication date: August 22, 2019
    Applicant: LumiShield Technologies Incorporated
    Inventors: Hunaid B. NULWALA, John D. WATKINS, Xu ZHOU
  • Publication number: 20180347058
    Abstract: Methods and compositions for electrodepositing mixed metal reactive metal layers by combining reactive metal complexes with electron withdrawing agents are provided. Modifying the ratio of one reactive metal complex to the other and varying the current density can be used to vary the morphology the metal layer on the substrate.
    Type: Application
    Filed: June 1, 2018
    Publication date: December 6, 2018
    Inventors: Hunaid B. NULWALA, John D. WATKINS