Abstract: Chip technology for fabricating ultra-low-noise, high-stability optical devices for use in an optical atomic clock system. The proposed chip technology uses diamond material to form stabilized lasers, frequency references, and passive laser cavity structures. By utilizing the exceptional thermal conductivity of diamond and other optical and dielectric properties, a specific temperature range of operation is proposed that allows significant reduction of the total energy required to generate and maintain an ultra-stable laser. In each configuration, the diamond-based chip is cooled by a cryogenic cooler containing liquid nitrogen.

Abstract: The present disclosure relates to a modular heat exchange tower that has a plurality of air inlet modules each having stanchion disposed therein. The modular heat exchange tower also includes a series of heat exchange modules positioned above the air inlet modules along with a series of plenum modules position above the heat exchange modules.

Abstract: A semiconductor device assembly and method of providing a semiconductor device assembly. The method includes providing a flexible interposer, providing a first redistribution layer on the flexible interposer, and providing a second redistribution layer on a portion of the first redistribution layer. The second redistribution layer is provided by additive manufacturing. The first redistribution layer may be deposited in a clean room environment. The first redistribution layer may be deposited via chemical deposition or physical deposition. A semiconductor device is attached to the first redistribution layer. The flexible interposer may be attached to a board with the semiconductor device being electrically connected to the board via the first redistribution layer, the flexible interposer, and the second redistribution layer. The flexible interposer may be attached to a flexible hybrid electronic (FHE) board.

Abstract: In examples, systems and methods for a conformal array are described. In one example, an array is described. The array includes a plurality of antenna elements formed in a conformal array. The conformal array is arranged on a non-planar surface. Additionally, the array includes a respective feed for each of at least a subset of the antennas of the plurality of antenna elements. Each feed of the array is coupled to a respective antenna of the plurality of antennas based on a taper profile determined based on the non-planar surface. In another example, a method of determining an antenna array is disclosed. The method includes determining a planar array configuration for a plurality of antennas. The method further includes mapping the planar array configuration to a conformal surface to form a conformal array. Additionally, the method includes determining a taper profile based on the conformal array.

Abstract: A broadband conformal antenna (“BCA”) is disclosed. The BCA includes a narrow approximately rectangular outer conductive (“NARO”) housing, a plurality of dielectric layers within the NARO housing forming a laminated dielectric structure, and an inner conductor formed within the laminated dielectric structure. The NARO housing includes a top broad wall and the BCA further includes an antenna slot within the top broad wall. The BCA is configured to support a transverse electromagnetic signal within the NARO housing.

Abstract: An apparatus for delivering alternate user input between an alternate input device and an output device, the output device configured to receive input from a conventional input device, the output device not configured to receive input from the alternate input device, the apparatus including an input interconversion processor that receives the alternate user input from the alternate input device, a processing pipeline that converts the alternate user input to a conventional user input of a type normally received by the output device from the conventional input device, and an output port that transmits the conventional user input.

Abstract: A semiconductor device assembly and method of providing a semiconductor device assembly. The method includes providing a flexible interposer, providing a first redistribution layer on the flexible interposer, and providing a second redistribution layer on a portion of the first redistribution layer. The second redistribution layer is provided by additive manufacturing. The first redistribution layer may be deposited in a clean room environment. The first redistribution layer may be deposited via chemical deposition or physical deposition. A semiconductor device is attached to the first redistribution layer. The flexible interposer may be attached to a board with the semiconductor device being electrically connected to the board via the first redistribution layer, the flexible interposer, and the second redistribution layer. The flexible interposer may be attached to a flexible hybrid electronic (FHE) board.

Abstract: A cooling device for an electromagnetic interference filter is disclosed. The cooling device includes a housing. The housing includes a main body having a cavity shaped to receive the electromagnetic interference filter and one or more cooling channels surrounding at least a portion of the cavity in the main body of the housing. The one or more cooling channels define one or more flow paths that are contained completely within the housing. The housing also includes an inlet port and an outlet port. The one or more cooling channels fluidly connect the inlet port to the outlet port, and a cooling medium is configured to flow into the inlet port, through the one or more cooling channels, and exit the housing through the outlet port.

Abstract: A device includes a plurality of electromagnetically bi-anisotropic devices, a conductive layer, and a spacer layer disposed between the plurality of electromagnetically bi-anisotropic devices and the conductive layer. The device also includes an electromagnetic interface device disposed between the plurality of electromagnetically bi-anisotropic devices and the conductive layer. The electromagnetic interface device is configured to output an electrical signal responsive to receipt of an electromagnetic wave.

Abstract: A honeycomb thermal insulation structure may comprise a first facesheet, a second facesheet, and a honeycomb core between the first facesheet and the second facesheet. The honeycomb core may include a plurality of honeycomb unit cells each composed of walls having a height and spaced by a distance. The walls of the honeycomb cells may have perforations. The honeycomb thermal insulation structure may further comprise a non-convective gas loaded in the honeycomb unit cells between the walls. A flow of the gas through the perforations may be substantially absent.

Abstract: A real time inspection and correction system and method for additive manufacturing process is described. The method may include operating a direct writing device configured to deposit material on a substrate through a tip to provide a portion of a product according to initial parameter values, receiving a hyperspectral image frame including a plurality of spectral images of the deposited material, processing the received hyperspectral image frame to determine a characteristic of the deposited material comparing the determined characteristic with a target characteristic determining at least one corrective parameter value to conform the determined characteristic to the target characteristic updating at least one of the initial parameter values with the corrective parameter values, and operating the direct writing device to deposit additional material on the substrate according to the corrective parameter value.

Abstract: Provided is a low-weight, high-efficiency inductor design for use with or in electrical power equipment, such as inverters. A toroidal power inductor includes a support structure comprising an outer shell, an inner shell, and one or more coolant channels formed therebetween, a plurality of conductors wrapped around and supported by an exterior surface of the outer shell, and an interior cavity substantially enclosed by the inner shell of the toroidal support structure. The plurality of conductors are configured to provide an inductance for the toroidal power inductor, and the one or more coolant channels are distributed beneath the exterior surface of the outer shell to cool the plurality of conductors. An air-core power inductor may implement the conductors using high-temperature superconducting (HTS) tapes cooled by cryogenic fluid flowing within the coolant channels.

Abstract: A device includes a plurality of electromagnetically bi-anisotropic devices, a conductive layer, and a spacer layer disposed between the plurality of electromagnetically bi-anisotropic devices and the conductive layer. The device also includes an electromagnetic interface device disposed between the plurality of electromagnetically bi-anisotropic devices and the conductive layer. The electromagnetic interface device is configured to output an electrical signal responsive to receipt of an electromagnetic wave.

Abstract: An apparatus for delivering alternate user input between an alternate input device and an output device, the output device configured to receive input from a conventional input device, the output device not configured to receive input from the alternate input device, the apparatus including an input interconversion processor that receives the alternate user input from the alternate input device, a processing pipeline that converts the alternate user input to a conventional user input of a type normally received by the output device from the conventional input device, and an output port that transmits the conventional user input.

Abstract: Provided is a cooling device, and methods of fabricating and operating such cooling devices, for electromagnetic induction (EMI) filters. Specifically, a cooling device is provided which comprises a housing enclosing the electromagnetic induction filter. The housing may comprise one or more of the following: one or more exterior chambers, one or more central flow channels, and peripheral flow channels. The one or more exterior chambers surround an exterior surface of the EMI filter. The one or more central flow channels extend the length of the center of the EMIR filter. The peripheral flow channels extend the length of the exterior of the electromagnetic induction filter. The peripheral flow channels may be disposed between one or more exterior chambers and open into the one or more exterior chambers. The one or more central flow channels, the peripheral flow channels, and the one or more exterior chambers are interconnected.

Abstract: An apparatus for delivering alternate user input between an alternate input device and an output device, the output device configured to receive input from a conventional input device, the output device not configured to receive input from the alternate input device, the apparatus including an input interconversion processor that receives the alternate user input from the alternate input device, a processing pipeline that converts the alternate user input to a conventional user input of a type normally received by the output device from the conventional input device, and an output port that transmits the conventional user input.

Abstract: The present disclosure relates to a modular heat exchange tower that has a plurality of air inlet modules each having stanchion disposed therein. The modular heat exchange tower also includes a series of heat exchange modules positioned above the air inlet modules along with a series of plenum modules position above said heat exchange modules.

Abstract: A method and apparatus for tuning a metamaterial cell. A set of electromagnetic properties of a tunable element associated with the metamaterial cell may be tuned. A resonance of the metamaterial cell may be adjusted in response to the set of electromagnetic properties being tuned. A range of frequencies over which the metamaterial cell provides a negative index of refraction may be changed in response to the resonance of the metamaterial cell changing.