Patents by Inventor John Dangler

John Dangler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9873132
    Abstract: An apparatus includes a spray module with at least one column of spray nozzles. Each spray nozzle is configured to deliver a processing substance on a semiconductor substrate during a process for semiconductor manufacturing as the semiconductor substrate moves past the spray module. The at least one column of spray nozzles is arranged with respect to a direction of travel of the semiconductor substrate so the semiconductor substrate passes the spray nozzles. A location module identifies a location of the semiconductor substrate with respect to the spray module. A spray pattern module determines a spray pattern of where a processing substance is to be delivered to the semiconductor substrate and a nozzle control module actuates each spray nozzle independently based on the spray pattern and a location of the semiconductor identified by the location module.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: January 23, 2018
    Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
    Inventors: John Dangler, Brian L. Carlson, Roger Krabbenhoft, Kevin A. Splittstoesser, Jeffrey A. Taylor
  • Publication number: 20160358830
    Abstract: An apparatus includes a spray module with at least one column of spray nozzles. Each spray nozzle is configured to deliver a processing substance on a semiconductor substrate during a process for semiconductor manufacturing as the semiconductor substrate moves past the spray module. The at least one column of spray nozzles is arranged with respect to a direction of travel of the semiconductor substrate so the semiconductor substrate passes the spray nozzles. A location module identifies a location of the semiconductor substrate with respect to the spray module. A spray pattern module determines a spray pattern of where a processing substance is to be delivered to the semiconductor substrate and a nozzle control module actuates each spray nozzle independently based on the spray pattern and a location of the semiconductor identified by the location module.
    Type: Application
    Filed: June 4, 2015
    Publication date: December 8, 2016
    Inventors: John Dangler, Brian L. Carlson, Roger Krabbenhoft, Kevin A. Splittstoesser, Jeffrey A. Taylor
  • Publication number: 20070155302
    Abstract: A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.
    Type: Application
    Filed: March 14, 2007
    Publication date: July 5, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John Dangler, Phillip Isaacs, Arvind Sinha
  • Publication number: 20070102092
    Abstract: A method for manufacturing multilayer flexible circuits is disclosed. The cross-sectional area of an unoccupied signal layer volume is initially determined. The unoccupied signal layer includes multiple conductive elements, and the unoccupied signal layer volume is formed between two of the conductive elements. Next, the thickness of an adhesive layer for filling the unoccupied signal layer volume is determined. Finally, the thickness of the adhesive layer is adjusted such that the adhesive layer only fills the unoccupied signal layer volume while the two conductive elements come in direct contact with a dielectric layer without any adhesive in between.
    Type: Application
    Filed: November 10, 2005
    Publication date: May 10, 2007
    Applicant: International Business Machines Corporation
    Inventors: John Dangler, Matthew Doyle
  • Publication number: 20060160421
    Abstract: In a flat flex cable, signal lines are surrounded by logic ground planes above and below which are viaed together left and right. The ground planes coupled with the flex cable dielectric determine characteristic the impedance and attenuation of the cable and provide differential signal EMI shielding. All signal layers and logic ground planes are enclosed within the two outermost shield layers which are viaed together left and right and around the connectors to enclose both signal layers and logic ground planes to provide common mode EMI shielding.
    Type: Application
    Filed: January 20, 2005
    Publication date: July 20, 2006
    Applicant: International Business Machines Corporation
    Inventors: John Dangler, Matthew Doyle, Thomas Kidd, Bradley Martin, Kevin Przybylski, Jason Stoll
  • Publication number: 20060090918
    Abstract: A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.
    Type: Application
    Filed: November 4, 2004
    Publication date: May 4, 2006
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John Dangler, Phillip Isaacs, Arvind Sinha