Patents by Inventor John Daugherty

John Daugherty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12270748
    Abstract: An apparatus for measuring contamination on a critical surface of a part is provided. A vessel for mounting the part is provided. An inert gas source is in fluid connection with the vessel and adapted to provide an inert gas to the vessel. At least one diffuser receives the inert gas from the vessel, wherein the critical surface of the part is exposed to the inert gas when the part is mounted in the vessel. At least one analyzer is adapted to receive inert gas from the at least one diffuser and measures contaminants in the inert gas.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: April 8, 2025
    Assignee: Lam Research Corporation
    Inventors: Amir A. Yasseri, Girish M. Hundi, John Michael Kerns, Duane Outka, John Daugherty, Cliff La Croix
  • Patent number: 12249490
    Abstract: A component of a plasma processing chamber having at least one plasma facing surface of the component comprises single crystal metal oxide material. The component can be machined from a single crystal metal oxide ingot. Suitable single crystal metal oxides include spinel, yttrium oxide, and yttrium aluminum garnet (YAG). A single crystal metal oxide can be machined to form a gas injector of a plasma processing chamber.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: March 11, 2025
    Assignee: Lam Research Corporation
    Inventors: Lin Xu, Douglas Detert, John Daugherty, Pankaj Hazarika, Satish Srinivasan, Nash W. Anderson, John Michael Kerns, Robin Koshy, David Joseph Wetzel, Lei Liu, Eric A. Pape
  • Patent number: 12198902
    Abstract: An apparatus adapted for use in a plasma processing chamber is provided. An aluminum body with at least one surface is provided. An aluminum oxide containing aerosol deposition coating is disposed over the at least one surface of the aluminum body. An yttrium containing aerosol deposition coating is disposed over the aluminum oxide containing aerosol deposition coating.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: January 14, 2025
    Assignee: Lam Research Corporation
    Inventors: Lin Xu, John Daugherty, Satish Srinivasan, David Joseph Wetzel
  • Patent number: 12129569
    Abstract: A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10?6/K. A metal oxide layer is then disposed over a surface of the component body.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: October 29, 2024
    Assignee: Lam Research Corporation
    Inventors: Lin Xu, David Joseph Wetzel, John Daugherty, Hong Shih, Satish Srinivasan, Yuanping Song, Johnny Pham, Yiwei Song, Christopher Kimball
  • Patent number: 12072318
    Abstract: An apparatus for measuring contaminants on a surface of a component is provided. An extraction vessel for holding a measurement fluid has an opening adapted to form a meniscus using the measurement fluid. An actuator moves at least one of the extraction vessel and the component to a position where the meniscus is in contact with the surface of the component. A transducer is positioned to provide acoustic energy to the measurement fluid.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: August 27, 2024
    Assignee: Lam Research Corporation
    Inventors: Amir A. Yasseri, Duane Outka, Armen Avoyan, Kennet Cresencio Baylon, John Daugherty, Girish M. Hundi, Cliff La Croix
  • Patent number: 12064795
    Abstract: A method for conditioning a component of a wafer processing chamber is provided. The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component. The component is submerged in a megasonic conditioning solution in a tank. Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: August 20, 2024
    Assignee: Lam Research Corporation
    Inventors: Amir A. Yasseri, Hong Shih, John Daugherty, Duane Outka, Lin Xu, Armen Avoyan, Cliff La Croix, Girish Hundi
  • Patent number: 11764086
    Abstract: A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: September 19, 2023
    Assignee: LAM RESEARCH CORPORATION
    Inventors: David Trussell, John Daugherty, Christopher J. Pena, Michael C. Kellogg, Klay Kunkel, Richard H. Gould
  • Patent number: 11124659
    Abstract: A method for providing a part with a plasma resistant ceramic coating for use in a plasma processing chamber is provided. A patterned mask is placed on the part. A film is deposited over the part. The patterned mask is removed. A plasma resistant ceramic coating is applied on the part.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: September 21, 2021
    Assignee: Lam Research Corporation
    Inventors: Amir A. Yasseri, Duane Outka, Hong Shih, John Daugherty
  • Patent number: 11112773
    Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: September 7, 2021
    Assignee: Lam Research Corporation
    Inventors: David D. Trussell, Alan J. Miller, John Daugherty, Alex Paterson
  • Patent number: 10967407
    Abstract: An apparatus for conditioning a component of a processing chamber is provided. A tank for holding a megasonic conditioning solution is provided. A mount holds the component immersed in a megasonic conditioning solution, when the tank is filled with the megasonic conditioning solution. A megasonic conditioning solution inlet system delivers the megasonic conditioning solution to the tank. A megasonic transducer head comprises at least one megasonic transducer to provide megasonic energy to the megasonic conditioning solution, wherein the megasonic energy is delivered to the component via the megasonic conditioning solution. A megasonic conditioning solution drain system drains the megasonic conditioning solution from the tank at a location above where the component is held in the megasonic conditioning solution. An actuator moves the megasonic transducer head across the tank.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: April 6, 2021
    Assignee: Lam Research Corporation
    Inventors: Amir A. Yasseri, Hong Shih, John Daugherty, Duane Outka, Lin Xu, Armen Avoyan, Cliff La Croix, Girish Hundi
  • Patent number: 10964514
    Abstract: An electrode for transmitting radiofrequency power to a plasma processing region includes a plate formed of semiconducting material and a high electrical conductivity layer formed on a top surface of the plate and integral with the plate. The high electrical conductivity layer has a lower electrical resistance than the semiconducting material of the plate. The electrode includes a distribution of through-holes. Each through-hole extends through an entire thickness of the electrode from a top surface of the high electrical conductivity layer to a bottom surface of the plate. In some embodiments, the plate can be formed of a silicon material and the high electrical conductivity layer can be a silicide material formed from the silicon material of the plate.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: March 30, 2021
    Assignee: Lam Research Corporation
    Inventors: Evan Edward Patton, John Daugherty
  • Patent number: 10790174
    Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: September 29, 2020
    Assignee: LAM RESEARCH CORPORATION
    Inventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard H. Gould, Klay Kunkel
  • Publication number: 20200244326
    Abstract: Antenna switch diversity circuitry can include four switches. A first switch can be connectable to a first transmitter, a first receiver, and a second receiver. A second switch can be connectable to a second transmitter, a third receiver, and a fourth receiver. A third switch can be directly connected to the first switch, the second switch, a first antenna, and a second antenna. A fourth switch directly can be connected to the first switch, the second switch, a third antenna, and a fourth antenna. The first and second switches can be configured to be controlled by a control signal in a manner so as to prevent a signal from the first transmitter and a signal from the second transmitter from being conveyed through a same switch, which can reduce a production of an intermodulation distortion signal by the signal from the first transmitter and the signal from the second transmitter.
    Type: Application
    Filed: January 24, 2019
    Publication date: July 30, 2020
    Inventors: John Daugherty, Vimalkaushik Natarajan
  • Patent number: 10715231
    Abstract: Antenna switch diversity circuitry can include four switches. A first switch can be connectable to a first transmitter, a first receiver, and a second receiver. A second switch can be connectable to a second transmitter, a third receiver, and a fourth receiver. A third switch can be directly connected to the first switch, the second switch, a first antenna, and a second antenna. A fourth switch directly can be connected to the first switch, the second switch, a third antenna, and a fourth antenna. The first and second switches can be configured to be controlled by a control signal in a manner so as to prevent a signal from the first transmitter and a signal from the second transmitter from being conveyed through a same switch, which can reduce a production of an intermodulation distortion signal by the signal from the first transmitter and the signal from the second transmitter.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: July 14, 2020
    Assignee: Google LLC
    Inventors: John Daugherty, Vimalkaushik Natarajan
  • Publication number: 20200111688
    Abstract: A cooling apparatus is provided. At least one power electronic component is provided. A fluid tight enclosure surrounds the at least one power electronic component. An inert dielectric fluid at least partially fills the fluid tight container and is in contact with the at least one power electronic component.
    Type: Application
    Filed: December 6, 2019
    Publication date: April 9, 2020
    Inventors: Sudhakar Gopalakrishinan, Peter Reimer, John Haruff, John Daugherty
  • Patent number: 10615009
    Abstract: A system for controlling processing state of a plasma process is provided. One example system includes a plasma reactor having a plurality of tuning knobs for making settings to operational conditions of the plasma reactor. A plurality of sensors of the plasma reactor is included, where each of the plurality of sensors is configured to produce a data stream of information during operation of the plasma reactor for carrying out the plasma process. A controller of the plasma reactor is configured to execute a multivariate processing that is configured to use as input desired processing state values that define intended measurable conditions within a processing environment of the plasma reactor and identify current plasma processing values. The multivariate processing uses a machine learning engine that receives as inputs the desired processing state values and data streams from the plurality of sensors during processing of the plasma process.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: April 7, 2020
    Assignee: Lam Research Corporation
    Inventors: Joydeep Guha, John Daugherty, Vahid Vahedi, Richard Alan Gottscho
  • Patent number: 10304707
    Abstract: A load lock assembly includes a first load lock connected between an equipment front end module (EFEM) and a wafer transport module, the EFEM being at a lab ambient condition, the wafer transport module being at a vacuum condition, the wafer transport module being part of a wafer transport assembly that is configured to transport wafers to and from one or more process modules that are connected to the wafer transport assembly; a second load lock disposed over the first load lock, the second load lock connected between the EFEM and the wafer transport module; a post-processing module disposed over the second load lock, the post-processing module configured for performing a post-processing operation on a processed wafer that has been processed in at least one of the process modules that are connected to the wafer transport assembly, the post-processing module being configured for connection to the wafer transport module.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: May 28, 2019
    Assignee: LAM RESEARCH CORPORATION
    Inventors: David Trussell, Richard Gould, John Daugherty
  • Publication number: 20190115189
    Abstract: An electrode for transmitting radiofrequency power to a plasma processing region includes a plate formed of semiconducting material and a high electrical conductivity layer formed on a top surface of the plate and integral with the plate. The high electrical conductivity layer has a lower electrical resistance than the semiconducting material of the plate. The electrode includes a distribution of through-holes. Each through-hole extends through an entire thickness of the electrode from a top surface of the high electrical conductivity layer to a bottom surface of the plate. In some embodiments, the plate can be formed of a silicon material and the high electrical conductivity layer can be a silicide material formed from the silicon material of the plate.
    Type: Application
    Filed: October 17, 2017
    Publication date: April 18, 2019
    Inventors: Evan Edward Patton, John Daugherty
  • Publication number: 20180247798
    Abstract: A system for controlling processing state of a plasma process is provided. One example system includes a plasma reactor having a plurality of tuning knobs for making settings to operational conditions of the plasma reactor. A plurality of sensors of the plasma reactor is included, where each of the plurality of sensors is configured to produce a data stream of information during operation of the plasma reactor for carrying out the plasma process. A controller of the plasma reactor is configured to execute a multivariate processing that is configured to use as input desired processing state values that define intended measurable conditions within a processing environment of the plasma reactor and identify current plasma processing values. The multivariate processing uses a machine learning engine that receives as inputs the desired processing state values and data streams from the plurality of sensors during processing of the plasma process.
    Type: Application
    Filed: April 30, 2018
    Publication date: August 30, 2018
    Inventors: Joydeep Guha, John Daugherty, Vahid Vahedi, Richard Alan Gottscho
  • Patent number: 10014196
    Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: July 3, 2018
    Assignee: LAM RESEARCH CORPORATION
    Inventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel