Patents by Inventor John Daugherty

John Daugherty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190233658
    Abstract: A method for providing a part with a plasma resistant ceramic coating for use in a plasma processing chamber is provided. A patterned mask is placed on the part. A film is deposited over the part. The patterned mask is removed. A plasma resistant ceramic coating is applied on the part.
    Type: Application
    Filed: January 30, 2018
    Publication date: August 1, 2019
    Inventors: Amir A. YASSERI, Duane OUTKA, Hong SHIH, John DAUGHERTY
  • Patent number: 10304707
    Abstract: A load lock assembly includes a first load lock connected between an equipment front end module (EFEM) and a wafer transport module, the EFEM being at a lab ambient condition, the wafer transport module being at a vacuum condition, the wafer transport module being part of a wafer transport assembly that is configured to transport wafers to and from one or more process modules that are connected to the wafer transport assembly; a second load lock disposed over the first load lock, the second load lock connected between the EFEM and the wafer transport module; a post-processing module disposed over the second load lock, the post-processing module configured for performing a post-processing operation on a processed wafer that has been processed in at least one of the process modules that are connected to the wafer transport assembly, the post-processing module being configured for connection to the wafer transport module.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: May 28, 2019
    Assignee: LAM RESEARCH CORPORATION
    Inventors: David Trussell, Richard Gould, John Daugherty
  • Publication number: 20190115189
    Abstract: An electrode for transmitting radiofrequency power to a plasma processing region includes a plate formed of semiconducting material and a high electrical conductivity layer formed on a top surface of the plate and integral with the plate. The high electrical conductivity layer has a lower electrical resistance than the semiconducting material of the plate. The electrode includes a distribution of through-holes. Each through-hole extends through an entire thickness of the electrode from a top surface of the high electrical conductivity layer to a bottom surface of the plate. In some embodiments, the plate can be formed of a silicon material and the high electrical conductivity layer can be a silicide material formed from the silicon material of the plate.
    Type: Application
    Filed: October 17, 2017
    Publication date: April 18, 2019
    Inventors: Evan Edward Patton, John Daugherty
  • Publication number: 20180318890
    Abstract: An apparatus for conditioning a component of a processing chamber is provided. A tank for holding a megasonic conditioning solution is provided. A mount holds the component immersed in a megasonic conditioning solution, when the tank is filled with the megasonic conditioning solution. A megasonic conditioning solution inlet system delivers the megasonic conditioning solution to the tank. A megasonic transducer head comprises at least one megasonic transducer to provide megasonic energy to the megasonic conditioning solution, wherein the megasonic energy is delivered to the component via the megasonic conditioning solution. A megasonic conditioning solution drain system drains the megasonic conditioning solution from the tank at a location above where the component is held in the megasonic conditioning solution. An actuator moves the megasonic transducer head across the tank.
    Type: Application
    Filed: May 2, 2018
    Publication date: November 8, 2018
    Inventors: Amir A. YASSERI, Hong SHIH, John DAUGHERTY, Duane OUTKA, Lin XU, Armen AVOYAN, Cliff LA CROIX, Girish HUNDI
  • Publication number: 20180247798
    Abstract: A system for controlling processing state of a plasma process is provided. One example system includes a plasma reactor having a plurality of tuning knobs for making settings to operational conditions of the plasma reactor. A plurality of sensors of the plasma reactor is included, where each of the plurality of sensors is configured to produce a data stream of information during operation of the plasma reactor for carrying out the plasma process. A controller of the plasma reactor is configured to execute a multivariate processing that is configured to use as input desired processing state values that define intended measurable conditions within a processing environment of the plasma reactor and identify current plasma processing values. The multivariate processing uses a machine learning engine that receives as inputs the desired processing state values and data streams from the plurality of sensors during processing of the plasma process.
    Type: Application
    Filed: April 30, 2018
    Publication date: August 30, 2018
    Inventors: Joydeep Guha, John Daugherty, Vahid Vahedi, Richard Alan Gottscho
  • Publication number: 20180235110
    Abstract: A cooling apparatus is provided. At least one power electronic component is provided. A fluid tight enclosure surrounds the at least one power electronic component. An inert dielectric fluid at least partially fills the fluid tight container and is in contact with the at least one power electronic component.
    Type: Application
    Filed: February 16, 2017
    Publication date: August 16, 2018
    Inventors: Sudhakar GOPALAKRISHNAN, Peter REIMER, John HARUFF, John DAUGHERTY
  • Publication number: 20180233387
    Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.
    Type: Application
    Filed: April 12, 2018
    Publication date: August 16, 2018
    Inventors: John DAUGHERTY, David TRUSSELL, Michael KELLOGG, Christopher PENA, Richard H. GOULD, Klay KUNKEL
  • Patent number: 10014196
    Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: July 3, 2018
    Assignee: LAM RESEARCH CORPORATION
    Inventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
  • Publication number: 20180144909
    Abstract: A method for coating a part body for use in a plasma processing chamber is provided. The part body is received into a chamber. At least part of a surface of the part body is coated by physical vapor deposition or chemical vapor deposition with a coating with a thickness of no more than 30 microns consisting essentially of a Lanthanide series or Group III or Group IV element in an oxyfluoride.
    Type: Application
    Filed: January 18, 2018
    Publication date: May 24, 2018
    Inventors: Lihua Li HUANG, Hong SHIH, Lin XU, John DAUGHERTY
  • Patent number: 9972478
    Abstract: Methods and systems for controlling processing state of a plasma reactor to initiate processing of production substrates and/or to determine a ready state of a reactor after the reactor has been cleaned and needs to be seasoned for subsequent production wafer processing are provided. The method initiate processing of a substrate in the plasma reactor using settings for tuning knobs of the plasma reactor that are approximated to achieve desired processing state values. A plurality of data streams are received from the plasma reactor during the processing of the substrate. The plurality of data streams are used to identify current processing state values. The method includes generating a compensation vector that identifies differences between the current processing state values and the desired processing state values. The generation of the compensation vector uses machine learning to improve and refile the identification and amount of compensation needed, as identified in the compensation vector.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: May 15, 2018
    Assignee: Lam Research Corporation
    Inventors: Joydeep Guha, John Daugherty, Vahid Vahedi, Richard Alan Gottscho
  • Publication number: 20180127868
    Abstract: A fluid handling component for a vacuum chamber of a semiconductor substrate processing apparatus is provided. The fluid handling component comprises interior fluid wetted surfaces and an atomic layer deposition (ALD) or molecular layer deposition (MLD) barrier coating on the interior fluid wetted surfaces wherein the fluid wetted surfaces which include the ALD or MLD barrier coating are configured to be contacted by a process gas and/or fluid during a semiconductor substrate processing process wherein the ALD or MLD barrier coating protects the underlying fluid wetted surfaces from erosion and/or corrosion.
    Type: Application
    Filed: December 15, 2017
    Publication date: May 10, 2018
    Inventors: Lin XU, Hong SHIH, Nash ANDERSON, Tom STEVENSON, John DAUGHERTY, John Michael KERNS, Robert Griffith O'NEILL
  • Patent number: 9947558
    Abstract: A method for conditioning and cleaning a silicon part is provided. The silicon part is heated to a temperature of at least 300° C. in the presence of oxygen to form an outer surface of the silicon part into silicon oxide. The silicon part is placed in a wet bath wherein the bath is a solution that selectively etches silicon oxide with respect to silicon.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: April 17, 2018
    Assignee: Lam Research Corporation
    Inventors: Lin Xu, Hong Shih, Robin Koshy, John Daugherty, Satish Srinivasan
  • Patent number: 9929028
    Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: March 27, 2018
    Assignee: Lam Research Corporation
    Inventors: David Trussell, John Daugherty, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
  • Publication number: 20180082826
    Abstract: Methods and systems for controlling processing state of a plasma reactor to initiate processing of production substrates and/or to determine a ready state of a reactor after the reactor has been cleaned and needs to be seasoned for subsequent production wafer processing are provided. The method initiate processing of a substrate in the plasma reactor using settings for tuning knobs of the plasma reactor that are approximated to achieve desired processing state values. A plurality of data streams are received from the plasma reactor during the processing of the substrate. The plurality of data streams are used to identify current processing state values. The method includes generating a compensation vector that identifies differences between the current processing state values and the desired processing state values. The generation of the compensation vector uses machine learning to improve and refile the identification and amount of compensation needed, as identified in the compensation vector.
    Type: Application
    Filed: September 16, 2016
    Publication date: March 22, 2018
    Inventors: Joydeep Guha, John Daugherty, Vahid Vahedi, Richard Alan Gottscho
  • Publication number: 20180047594
    Abstract: A method for conditioning and cleaning a silicon part is provided. The silicon part is heated to a temperature of at least 300° C. in the presence of oxygen to form an outer surface of the silicon part into silicon oxide. The silicon part is placed in a wet bath wherein the bath is a solution that selectively etches silicon oxide with respect to silicon.
    Type: Application
    Filed: August 12, 2016
    Publication date: February 15, 2018
    Inventors: Lin XU, Hong SHIH, Robin KOSHY, John DAUGHERTY, Satish SRINIVASAN
  • Publication number: 20180032062
    Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.
    Type: Application
    Filed: August 2, 2017
    Publication date: February 1, 2018
    Inventors: David D. Trussell, Alan J. Miller, John Daugherty, Alex Paterson
  • Patent number: 9873940
    Abstract: A coating system for forming an atomic layer deposition (ALD) or a molecular layer deposition (MLD) barrier coating on interior fluid wetted surfaces of a fluid handling component for a vacuum chamber of a semiconductor substrate processing apparatus. The coating system includes the fluid handling component, wherein the interior fluid wetted surfaces define a process region of the coating system, a gas supply system in fluid communication with the process region of the component wherein the gas supply system supplies process gases to the process region of the component through the inlet port thereof such that an ALD or MLD barrier coating can be formed on the fluid wetted surfaces of the fluid handling component, and an exhaust system in fluid communication with the process region of the component wherein the exhaust system exhausts the process gases from the process region of the component through the outlet port thereof.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: January 23, 2018
    Assignee: Lam Research Corporation
    Inventors: Lin Xu, Hong Shih, Nash Anderson, Tom Stevenson, John Daugherty, John Michael Kerns, Robert Griffith O'Neill
  • Publication number: 20170115657
    Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.
    Type: Application
    Filed: October 22, 2015
    Publication date: April 27, 2017
    Inventors: David D. Trussell, Alan J. Miller, John Daugherty, Alex Paterson
  • Publication number: 20170110354
    Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 20, 2017
    Inventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
  • Publication number: 20170110350
    Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.
    Type: Application
    Filed: October 18, 2016
    Publication date: April 20, 2017
    Inventors: David Trussell, John Daugherty, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel