Patents by Inventor John David Davies
John David Davies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230333482Abstract: A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.Type: ApplicationFiled: June 21, 2023Publication date: October 19, 2023Applicant: ASML NETHERLANDS B.V.Inventors: Arnaud HUBAUX, Johan Franciscus Maria Beckers, Dylan John David Davies, Johan Gertrudis Cornelis Kunnen, Willem Richard Pongers, Ajinkya Ravindra Daware, Chung-Hsun Li, Georgios Tsirogiannis, Hendrik Cornelis Anton Borger, Frederik Eduard De Jong, Juan Manuel Gonzalez Huesca, Andriy Hlod, Maxim Pisarenco
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Patent number: 11687007Abstract: A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.Type: GrantFiled: January 9, 2020Date of Patent: June 27, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Arnaud Hubaux, Johan Franciscus Maria Beckers, Dylan John David Davies, Johan Gertrudis Cornelis Kunnen, Willem Richard Pongers, Ajinkya Ravindra Daware, Chung-Hsun Li, Georgios Tsirogiannis, Hendrik Cornelis Anton Borger, Frederik Eduard De Jong, Juan Manuel Gonzalez Huesca, Andriy Hlod, Maxim Pisarenco
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Publication number: 20220082949Abstract: A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.Type: ApplicationFiled: January 9, 2020Publication date: March 17, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Arnaud HUBAUX, Johan Franciscus Maria BECKERS, Dylan John David DAVIES, Johan Gertrudis Cornelis KUNNEN, Willem Richard PONGERS, Ajinkya Ravindra DAWARE, Chung-Hsun LI, Georgios TSIROGIANNIS, Hendrik Cornelis Anton BORGER, Frederik Eduard DEJONG, Juan Manuel GONZALEZ HUESCA, Andriy HLOD, Maxim PISARENCO
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Patent number: 10613445Abstract: A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.Type: GrantFiled: March 25, 2019Date of Patent: April 7, 2020Assignee: ASML Netherlands B.V.Inventors: Marc Hauptmann, Dylan John David Davies, Paul Janssen, Naoko Tsugama, Richard Joseph Bruls, Kornelis Tijmen Hoekerd, Edwin Johannes Maria Janssen, Petrus Johannes Van Den Oever, Ronald Van Der Wilk, Antonius Hubertus Van Schijndel, Jorge Alberto Vieyra Salas
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Publication number: 20190219929Abstract: A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high- resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.Type: ApplicationFiled: March 25, 2019Publication date: July 18, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Marc Hauptmann, Dylan John David Davies, Paul Janssen, Naoko Tsugama, Richard Joseph Bruls, Kornelis Tijmen Hoekerd, Edwin Johannes Maria Janssen, Petrus Johannes Van Den Oever, Ronald Van Der Wilk, Antonius Hubertus Van Schijndel, Jorge Alberto Vieyra Salas
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Patent number: 10241418Abstract: A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.Type: GrantFiled: September 21, 2015Date of Patent: March 26, 2019Assignee: ASML Netherlands B.V.Inventors: Marc Hauptmann, Dylan John David Davies, Paul Janssen, Naoko Tsugama, Richard Joseph Bruls, Kornelis Tijmen Hoekerd, Edwin Johannes Maria Janssen, Petrus Johannes Van Den Oever, Ronald Van Der Wilk, Antonius Hubertus Van Schijndel, Jorge Alberto Vieyra Salas
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Publication number: 20170363969Abstract: A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.Type: ApplicationFiled: September 21, 2015Publication date: December 21, 2017Applicant: ASML NETHERLANDS B.V.Inventors: Marc HAUPTMANN, Dylan John David DAVIES, Paul JANSSEN, Naoko TSUGAMA, Richard Joseph BRULS, Kornelis Tijmen HOEKERD, Edwin Johannes Maria JANSSEN, Petrus Johannes VAN DEN OEVER, Ronald VAN DER WILK, Antonius Hubertus VAN SCHIJNDEL, Jorge Alberto VIEYRA SALAS
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Patent number: 4017060Abstract: A vibratory feeder, conveyor, separator, screen, or other vibratory equipment used in materials handling and related fields of the tuned two mass type in which one mass is an imbalance generator of the type using eccentric weights on a rotating shaft uses helical coil springs for coupling the imbalance generator to the trough or the like without clamping of the ends of the springs or constraining them to remain parallel to each other. Decoupling of the lateral oscillatory forces from the trough is achieved by using at least two pairs of collinear springs, one of each pair on each side of a wall member secured to the trough, and each held in compression between the wall member and a pair of vibrator plates held in fixed spaced apart relationship on each side of the wall member. The imbalance generator is secured to one of the vibrator plates so as to be well outside the spring system thus giving a low natural lateral frequency to the two mass system.Type: GrantFiled: May 28, 1976Date of Patent: April 12, 1977Assignee: International Combustion Australia LimitedInventors: James Edward Brander, John David Davies