Patents by Inventor John David Molnar

John David Molnar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Closed loop wire bonding methods and bonding force calibration
    Patent number: 8302840
    Abstract: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: November 6, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Wei Qin, Ziauddin Ahmad, John David Molnar, Deepak Sood, E. Walter Frasch, Chunlong Hu
  • CLOSED LOOP WIRE BONDING METHODS AND BONDING FORCE CALIBRATION
    Publication number: 20100108744
    Abstract: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
    Type: Application
    Filed: October 5, 2007
    Publication date: May 6, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Wei Qin, Ziauddin Ahmad, John David Molnar, Deepak Sood, E. Walter Frasch, Chunlong Hu