Patents by Inventor John David Moran

John David Moran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor diode and method therefor
    Patent number: 7189610
    Abstract: In one embodiment, a diode is formed with anodes on two surfaces of a semiconductor substrate.
    Type: Grant
    Filed: October 18, 2004
    Date of Patent: March 13, 2007
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: John David Moran, Blanca Estela Kruse, Jose Rogelio Moreno
  • Clamp disposed at edge of a dielectric structure in a semiconductor device and method of forming same
    Patent number: 5804869
    Abstract: A semiconductor structure (10) uses a clamp (16) disposed at an edge (27) of a dielectric structure (14) in a semiconductor device. The clamp substantially reduces the separation or peeling of the dielectric structure or layer away from the underlying semiconductor material (20,24). The clamp also provides the benefit of protecting the interface between the dielectric layer and the underlying semiconductor material from chemical or moisture attack, either during later processing or after final manufacture. Such chemical or moisture attack and internal film stress are factors leading to separation of the dielectric film from the underlying semiconductor material. The clamp is useful, for example, in preventing separation of silicon nitride or oxide passivation from gallium arsenide substrates in power rectifier diodes.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: September 8, 1998
    Assignee: Motorola, Inc.
    Inventors: Peyman Hadizad, Ali Salih, John Robert Bender, John David Moran