Abstract: A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.

Abstract: A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.

Abstract: A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.

Abstract: A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.

Abstract: A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.

Abstract: A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.

Abstract: A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.

Abstract: A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.

Abstract: A precise fiber array is formed using a chuck to tightly hold as an array with hexagonal packing a group of precision ferrules into ones of which is inserted and bonded a fiber end. The bonding is typically performed by gluing the fiber into the ferrule. The ferrules may also be bonded to each other. Once the ferrules are bonded together, the chuck may be removed. The terminating end of the fibers may be polished. Alternatively, cleaved terminating fiber ends may be employed, with the various terminating ends being coordinated, e.g., by an optical flat. The ferrules may have a tip and a conical entrance. The chuck may hold the ferrules in a straight orientation. The fiber terminating faces of all of the ferrules may be substantially coplanar. The ferrules may be arranged in a hexagonal configuration.

Abstract: A fiber array faceplate for receiving, precisely positioning and immobilizing bare optical fiber. The faceplate includes a plate arrangement of at least two mutually parallel plates each having an array of fixed apertures. At least one of the plates is movable in translational motion such that the at least two plates collectively define an array of adjustable-size apertures that can open wide enough to readily receive bare optical fiber and then decrease in size to immobilize the received optical fiber.

Abstract: A system containing an improved adapter for passively aligning an active device such as a transceiver with an optical fiber having a 100 to 250 &mgr;m core is provided, such that the resulting coupling is within alignment tolerances, and provides desired coupling efficiencies and bit rates. In one embodiment, the system contains a packaged active device having a window or a lens, an optical fiber having a core of a diameter ranging from 100 to 250 &mgr;m, and a fiber connector attached to an end of the optical fiber such that a fiber endface is provided. The system further contains an adapter comprising a first receptacle that secures the fiber connector and a second receptacle that secures the packaged device, wherein the exterior of the device package, in combination with the second receptacle, itself provides passive alignment within the adapter.

Abstract: A precise fiber array is formed using a chuck to tightly hold as an array with hexagonal packing a group of precision ferrules into ones of which is inserted and bonded a fiber end. The bonding is typically performed by gluing the fiber into the ferrule. The ferrules may also be bonded to each other. Once the ferrules are bonded together, the chuck may be removed. The terminating end of the fibers may be polished. Alternatively, cleaved terminating fiber ends may be employed, with the various terminating ends being coordinated, e.g., by an optical flat. The ferrules may have a tip and a conical entrance. The chuck may hold the ferrules in a straight orientation. The fiber terminating faces of all of the ferrules may be substantially coplanar. The ferrules may be arranged in a hexagonal configuration.

Abstract: A fiber array faceplate for receiving, precisely positioning and immobilizing bare optical fiber. The faceplate includes a plate arrangement of at least two mutually parallel plates each having an array of fixed apertures. At least one of the plates is movable in translational motion such that the at least two plates collectively define an array of adjustable-size apertures that can open wide enough to readily receive bare optical fiber and then decrease in size to immobilize the received optical fiber.

Abstract: A reflective element, such as a mirror, includes a substrate and a reflective layer formed thereon. The substrate comprises at least one thixotropic metal alloy, which is injected into a mold to form the shape desired for the reflective element. The reflective element may also include an interface layer comprising a thermoset material, such as an epoxy resin, formed between the substrate and the reflective layer to increase the smoothness of the substrate.

Abstract: In accordance with the invention, an optical fiber array comprises a substrate providing a planar array of optical fibers. The optical fibers are parallel to an array axis, but the fiber ends present smooth, polished surfaces angled from the array axis to minimize return loss of light directed along the axis. Three embodiments are described. The first is a series of 1×n strip arrays each mounted at an angle to the array axis to form a saw tooth configuration faceplate. The holes in each strip are also angled to compensate for the angled mount. A second embodiment uses an angled planar faceplate having tapered holes. A third embodiment uses an angled faceplate planar with double-tapered holes to obtain the angled end surfaces. In each embodiment, the fiber ends are substantially coplanar with the faceplate surface but the ends are angled with respect to the array axis.

Abstract: A reflective element, such as a mirror, includes a substrate and a reflective layer formed thereon. The substrate comprises at least one thixotropic metal alloy, which is injected into a mold to form the shape desired for the reflective element. The reflective element may also include an interface layer comprising a thermoset material, such as an epoxy resin, formed between the substrate and the reflective layer to increase the smoothness of the substrate.

Abstract: A faceplate for network switching apparatus is formed of a multi-layered structure having a first material layer and a second material layer. An outer portion of the faceplate is formed of the first material layer. The first material layer is an anti static material. An inner portion of the faceplate is formed of the second material layer. The second material layer is formed of an electromagnetic interference (EMI) shielding material. The first material layer and the second material layer are formed of polymeric materials which are rigid after extrusion. In an alternative embodiment, a gasket is coextruded with the first material layer and the second material layer. The gasket protrudes laterally from the inner portion of the faceplate along the length thereof. The gasket is formed of a third material layer. The third material layer is an EMI shielding material. The third material layer is formed of a polymeric material which is flexible after extrusion.

Abstract: Electronic devices include at least two electronic components in electrical contact by a connector, the components being at least partially encased by a molded resin. Preferably, the connector is a compression connector and the molded resin maintains a compressive force on the connector to ensure that reliable contact is maintained.

Abstract: A compact temperature compensating device for an optical fiber grating includes an inner expansion member disposed concentrically within and in a substantially parallel relationship with an outer expansion member. The outer expansion member has a coefficient of thermal expansion greater than that of the inner expansion member. The device further includes a base member and a pivoting lever. The base member is fixedly attached to a distal end of the outer and inner expansion members and to a distal end of the fiber grating disposed concentrically within the inner expansion member.

Abstract: An encapsulated package for a power magnetic device and a method of manufacture therefor. The power magnetic device has a magnetic core subject to magnetostriction when placed under stress. The package includes: (1) compliant material disposed about at least a portion of the magnetic core and (2) an encapsulant substantially surrounding the compliant material and the magnetic core, the compliant material providing a medium for absorbing stress between the encapsulant and the magnetic core, the compliant material reducing the magnetostriction upon the magnetic core caused by the stress from the encapsulant. In one embodiment, the encapsulant includes a vent to an environment surrounding the package. The vent provides pressure relief for the compliant material, allowing the compliant material to substantially eliminate the magnetostrictive effects.