Patents by Inventor John Davisson

John Davisson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation
    Patent number: 11387190
    Abstract: The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: July 12, 2022
    Assignee: QORVO US, INC.
    Inventors: Thomas Scott Morris, Stephen Craig Parker, Jerry Holt, John Davisson, Rommel Quintero Nevarez
  • SHIELDED ELECTRONIC MODULES AND METHODS OF FORMING THE SAME UTILIZING PLATING AND DOUBLE-CUT SINGULATION
    Publication number: 20210020583
    Abstract: The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.
    Type: Application
    Filed: October 7, 2020
    Publication date: January 21, 2021
    Inventors: Thomas Scott Morris, Stephen Craig Parker, Jerry Holt, John Davisson, Rommel Quintero Nevarez
  • Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation
    Patent number: 10811364
    Abstract: The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: October 20, 2020
    Assignee: Qorvo US, Inc.
    Inventors: Thomas Scott Morris, Stephen Craig Parker, Jerry Holt, John Davisson, Rommel Quintero Nevarez
  • SHIELDED ELECTRONIC MODULES AND METHODS OF FORMING THE SAME UTILIZING PLATING AND DOUBLE-CUT SINGULATION
    Publication number: 20200303318
    Abstract: The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 24, 2020
    Inventors: Thomas Scott Morris, Stephen Craig Parker, Jerry Holt, John Davisson, Rommel Quintero Nevarez