Abstract: in general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin seated within an assembly that forms a hermetic sealed, coaxial structure to prevent signal loss at increasing frequencies.

Abstract: in general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin seated within an assembly that forms a hermetic sealed, coaxial structure to prevent signal loss at increasing frequencies.

Abstract: A method for affixing a resonator to a printed circuit board is provided. The method uses a thin metal film which may be affixed to a surface of a stand off, or directly to a surface of a resonator. The metalized surface may be affixed to a printed circuit board using a molten agent with a surface tension which withstands the downward force exerted by the puck's weight. The metalized surface may be affixed to a printed circuit board using a solder paste and the solder is allowed to reflow. The surface tension of the molten solder causes the resonator (or resonator puck) to self-center, ensuring proper placement and eliminating the need for repositioning. Since the resonator is not positioned using traditional glues which are subject to shifting during transportation or curing, then the resonator is not subject to shifting, eliminating the need to reposition the resonator after the resonator becomes fixed.