Patents by Inventor John DeWys

John DeWys has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resistance welded solder crimp for joining stranded wire to a copper lead-frame
    Publication number: 20070077684
    Abstract: A method of connecting stranded wire to a lead-frame body 10 includes the provision of a stranded wire 12. It is ensured that insulation is stripped from an end 14 of the stranded wire. An electrically conductive lead-frame connection structure 16 is associated with the lead-frame body. The end 14 of the stranded wire is inserted into the lead-frame connection structure 16 so that the lead-frame connection structure substantially surrounds the wire end. Solder flux is injected so as to be substantially about a portion of the end of the stranded wire. The lead-frame connection structure is placed in contact with a bottom resistance welding electrode 18 or a top resistance welding electrode 20.
    Type: Application
    Filed: October 3, 2006
    Publication date: April 5, 2007
    Applicant: Siemens VDO Automotive Inc.
    Inventors: John DeWys, Sergey Tyshchuk, Johannes Brouwers, Murray Van Duynhoven, John Makaran