Patents by Inventor John Di Santis

John Di Santis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for plating pin grid array packaging modules
    Patent number: 5869139
    Abstract: An apparatus and a method for its use for plating pin grid array packaging modules, with a fixture capable of simultaneously holding a plurality of said pin grid array modules such that three-dimensional bottom surface metallurgy (BSM) is sealingly protected during plating of top surface metallurgy (TSM).
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: February 9, 1999
    Assignee: International Business Machines Corporation
    Inventors: Glen N. Biggs, John Di Santis, Paul F. Findeis, Karen P. McLaughlin, Phillip W. Palmatier, Victor M. Vitek