Abstract: An ultrasound horn is provided which vibrates a bonding tool, attached at a tip, in a plurality of directions with a simple structure. There is provided an ultrasound horn having: a longitudinal vibration generator; a horn portion; and a torsional vibration generator. The torsional vibration generator includes a body including a polygonal pillar portion, second layered elements in which a plurality of second piezoelectric elements are layered, and which are attached to side surfaces of the polygonal pillar portion, weights, and a pressure application ring which applies a pressure by pressing the second piezoelectric elements against the polygonal pillar portion via the weights.

Abstract: An ultrasound horn is provided which vibrates a bonding tool, attached at a tip, in a plurality of directions with a simple structure. There is provided an ultrasound horn having: a longitudinal vibration generator; a horn portion; and a torsional vibration generator. The torsional vibration generator includes a body including a polygonal pillar portion, second layered elements in which a plurality of second piezoelectric elements are layered, and which are attached to side surfaces of the polygonal pillar portion, weights, and a pressure application ring which applies a pressure by pressing the second piezoelectric elements against the polygonal pillar portion via the weights.

Abstract: An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.

Abstract: An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.

Abstract: An electronic chip package includes a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base.

Abstract: A heat sink for cooling an integrated circuit device includes a body having a first side and a second side. A fluid inlet opening is formed in the second side of the body for receiving pressurized fluid from a fluid source. A plurality of impingement openings are formed in the first side of the body. At least one fluid delivery channel is provided and configured to deliver pressurized fluid from the fluid inlet opening to the plurality of impingement openings for generating a plurality of fluid streams expelled from the plurality of impingement openings. A plurality of fluid diverters are formed on the first side of the body and arranged generally between each of the plurality of impingement openings for diverting a flow of fluid around each of the plurality of impingement openings.

Abstract: An electronic chip package includes a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base.

Abstract: A solar heat collecting element for use in solar troughs and solar power systems. The solar heat collecting element includes a conduit for carrying a heat transfer fluid; a light transparent envelope disposed about the conduit; and an edge welded metal bellows assembly coupling a first end of the conduit with a first end of the envelope.

Abstract: An electronic chip package including a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base.

Abstract: A solar heat collecting element for use in solar troughs and solar power systems. The solar heat collecting element includes a conduit for carrying a heat transfer fluid; a light transparent envelope disposed about the conduit; and an edge welded metal bellows assembly coupling a first end of the conduit with a first end of the envelope.

Abstract: An integrated circuit amplifier comprises: a first planar substrate having an upper surface and a lower surface; a second planar substrate having an upper surface and a lower surface, the lower surface of the second planar substrate physically affixed to the upper surface of the first planar substrate; at least one transistor pair comprising a first and second transistor, formed in the upper surface of the second planar substrate; and a conductor electrically coupling a drain electrode of the first transistor to a source electrode of the second transistor. The first substrate material may have a higher thermal conductivity than the second substrate material. The first material may be Silicon Carbide and may have a thickness of about 10 mils. The second material may be Gallium Arsenide and may have a thickness of about 1 to 2 mils.

Abstract: A receiver used in a solar collection assembly includes a tube adapted to carry a heat transfer medium therethrough. An envelope surrounds the tube and has opposed ends and a diaphragm is interposed between each end and the tube to support the tube from the envelope. The diaphragm comprises radially oriented convolutions which minimizes the axial length of the diaphragm and hence reduces shading of the absorber tube.

Abstract: A retaining device for a printed circuit board includes an expandable bladder. The bladder is responsive to a source of pressurized fluid for selectively clamping a printed circuit board within a slot of an associated cooling and/or storage chassis. A method for retaining a circuit card within a chassis includes pressurizing a volume of fluid, and filling an expandable bladder with the pressurized fluid; wherein filling of the bladder causes its expansion and clamps a circuit card within the chassis.

Abstract: An integrated circuit comprises a GaAs substrate thermally and mechanically mounted on a SiC substrate. The GaAs substrate is doped to define first and second transistors. Circuit conductors are defined on the GaAs substrate, which conductors interconnect the source of the first transistor to neutral and the drain to the source of the second transistor. Conductors connect the gate of the second transistor to neutral, to define a cascode amplifier. The SiC substrate supports first and second matching circuits, one of which is connected to the gate of the first transistor, and the other of which is connected to the drain of the second transistor.

Abstract: A receiver used in a solar collection assembly includes a tube adapted to carry a heat transfer medium therethrough. An envelope surrounds the tube and has opposed ends and a diaphragm is interposed between each end and the tube to support the tube from the envelope. The diaphragm comprises radially oriented convolutions which minimizes the axial length of the diaphragm and hence reduces shading of the absorber tube.

Abstract: A matched glass-to-metal connecting device for use in a vacuum tube collector for a solar energy collecting apparatus is made of a glass envelope and a metal sleeve directly bonded to the glass envelope. The glass envelope is made of a glass having a composition, in percent by weight on the basis of oxide content, consisting essentially of B2O3, 19; Al2O3, 8; Na2O, 2; K2O2, 3; BaO, 3; LiF, 1; and balance of SiO2 and the metal sleeve consists of metal material number 1.3981 of DIN 17745. The glass envelope has a thermal expansion coefficient that deviates from the metal part's thermal expansion coefficient by no more than 4% in the temperature range from 25° C. to 350° C.

Abstract: A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.

Abstract: A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

Abstract: An integrated circuit tester includes a fail-safe mechanism for moving an integrated circuit chip between an initial position where the integrated circuit chip is inserted into the tester, and a test position where the integrated circuit chips is actually tested. This fail-safe mechanism includes a motor and a shaft which the motor rotates to move the integrated circuit chip. An electronic control circuit can be included to automatically stop the motor when the integrated circuit reaches its initial position, or its test position; but if the control circuit fails to operate properly, then damage to the integrated circuit tester is prevented by the fail-safe mechanism.