Abstract: Disclosed is a polyimide film that exhibits: an in-plane coefficient of thermal expansion (CTE) that is less than 75 ppm/° C. between 50° C. and 250° C.; a glass transition temperature (Tg) that is greater than 250° C. for the polyimide film cured at 260° C. in air; a 1% TGA weight loss temperature that is greater than 450° C.; a tensile modulus that is between 1.5 GPa and 5.0 GPa; an elongation to break that is greater than 20%; an optical retardation at 550 nm that is less than 100 nm for a 10-?m film; a birefringence at 633 nm that is less than 0.002; a haze that is less than 1.0%; a b* that is less than 3; a yellowness index that is less than 5; and an average transmittance between 380 nm and 780 nm that is greater than 88%.

Abstract: Disclosed is a polyimide having a repeat unit structure of Formula III In Formula III: Ra represents one or more different tetracarboxylic acid component residues; and Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues. 5-100 mol % of Ra has Formula II In Formula II: R is H, halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R2 is halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R3 and R4 are the same or different and are alkyl, fluoroalkyl, or silyl; x and y are the same or different and are an integer from 0-2; and * indicates a point of attachment.

Abstract: Disclosed is a polyimide film generated from a solution containing a polyamic acid in a high-boiling, aprotic solvent; wherein the polyamic acid comprises one or more tetracarboxylic acid components and one or more diamine components; and wherein at least one of the tetracarboxylic acid components is a quadrivalent organic group derived from a bent dianhydride or an aromatic dianhydride comprising —O—, —CO—, —NHCO—, —S—, —SO2—, —CO—O—, or —CR2— links, or a direct chemical bond between aromatic rings; and wherein at least one of the diamine components is a divalent organic group derived from a bent diamine or an aromatic diamine comprising the same links, or a direct chemical bond between aromatic rings; and wherein R is the same or different at each occurrence and is selected from the group consisting of H, F, alkyl, and fluoroalkyl.

Abstract: Disclosed is a solution containing a polyamic acid in a high-boiling, aprotic solvent; wherein the polyamic acid contains two or more tetracarboxylic acid components and one or more diamine components; and wherein at least one of the tetracarboxylic acid components is a quadrivalent organic group derived from an aliphatic dianhydride. Polyimide films made from the solutions are also disclosed, as are their methods of production and uses in electronic devices.

Abstract: A solution comprising a polyamic acid in a high-boiling, aprotic solvent wherein the polyamic acid comprises three or more tetracarboxylic acid components and one or more diamine components such that a polyimide film can be made from the solution, and the film exhibits properties appropriate for use in electronics applications. Methods for preparing the film are disclosed.

Abstract: A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.

Abstract: A method of manufacturing a solar cell electrode comprising steps of: preparing a semiconductor substrate, applying a conductive paste onto the light receiving side of the semiconductor substrate, wherein the conductive paste comprises (i) a conductive powder, (ii) a glass frit, (iii) an organic polymer comprising an elastomer and (iv) an organic solvent; and firing the applied conductive paste.

Abstract: A method of manufacturing an electrical device comprising steps of: preparing a substrate; applying a conductive paste onto the substrate, wherein the conductive paste comprises (i) an inorganic powder comprising at least a conductive powder, (ii) an organic polymer, (iii) a solvent and (iv) a gellant selected from the group consisting of a polyalkyleneoxy terminated polyamide (PAOPA), an ester terminated polyamide (ETPA), polyether polyamine (PEPA) and a mixture thereof; and heating the applied conductive paste to form an electrode.

Abstract: A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.

Abstract: The present invention relates to the design, construction and manufacture of a novel electrical high temperature heater having a polymer thick film conductor paste with which to form an electrode on resistive film.

Abstract: A method of manufacturing an electrical device comprising steps of: preparing a substrate; applying a conductive paste onto the substrate, wherein the conductive paste comprises (i) an inorganic powder comprising at least a conductive powder, (ii) an organic polymer, (iii) a solvent and (iv) a gellant selected from the group consisting of a polyalkyleneoxy terminated polyamide (PAOPA), an ester terminated polyamide (ETPA), polyether polyamine (PEPA) and a mixture thereof; and heating the applied conductive paste to form an electrode.

Abstract: A method of manufacturing a solar cell electrode comprising steps of: preparing a semiconductor substrate, applying a conductive paste onto the light receiving side of the semiconductor substrate, wherein the conductive paste comprises (i) a conductive powder, (ii) a glass frit, (iii) an organic polymer comprising an elastomer and (iv) an organic solvent; and firing the applied to conductive paste.

Abstract: The invention relates to UV-curable dielectric ink formulations useful in digital manufacturing electric circuitry and devices. These compositions are useful in inkjet printing of electronic materials.

Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.

Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.

Abstract: A process for making a composite ion exchange membrane including fabricating a layered membrane precursor including a microporous support of highly fluorinated nonionic polymer adhered to a layer of highly fluorinated sulfonyl halide polymer, hydrolyzing the layered membrane precursor to convert the highly fluorinated sulfonyl halide polymer to highly fluorinated sulfonate polymer, impregnating the microporous support with a dispersion of highly fluorinated sulfonate polymer or precursor thereof in a polar liquid medium after hydrolyzing, removing the polar liquid medium, and heating to coalesce the highly fluorinated sulfonated polymer in the support.