Abstract: An insulated glass unit (IGU) characterized by a transmitted IGU color (a*IGU; b*IGU) includes a photovoltaic structure characterized by a first transmitted color (a*1; b*1) and a low emissivity structure characterized by a second transmitted color (a*2; b*2). The first transmitted color and the second transmitted color are complementary.

Abstract: A rectangular hand-mounted connector with d-shaped geometrical bay areas for providing easy mounting or dismounting compatibility in a commercial application without the use of any special tool is disclosed. The connector system uses a plurality of hooks located at the top and bottom of the receptacle shell to mate with a plurality of draw latches or bail latches at the top and bottom of the plug shell. In an alternative embodiment, a vertical clamping latch system is used to engage the receptacle and plug assembly. A polarization key in the receptacle shell provides latch tension when it is mated with its mating part from the plug shell. Strain reliefs may be connected to the receptacle or plug shell and may further having a plurality of ground studs for grounding the electrical contacts.

Abstract: An electromagnetic interference (EMI) and environmentally protected cap assembly for electrical connectors, for use when the mating connector is not in place, includes a hollow outer housing having a large diameter rear end and a smaller diameter front end having inwardly directed teeth for locking behind the outwardly extending lugs on the cylindrical form of the connector. An inner body member which is rotatable with respect to the housing, is spring biased by a plurality of wave washers toward the front of the outer housing. The inner housing has recesses which mate with the lugs on the connector to prevent relative rotation of these two parts, and detenting means are provided between the housing and the inner body member for locking the cap assembly onto the connector when the outer housing is assembled to the connector and rotated.

Abstract: A quantity of circuit chips are slidingly received in end to end relation in an elongated receptacle or "stick". The required number of such sticks are located in parallel groups at each side of a substrate mounted on an adjustable support. A pair of vacuum heads reciprocate along a path transversely of the substrate a fixed amount from a first extreme with the vacuum head located immediately over the endmost chip in a stick, to a second extreme which is a constant distance from the first position and lying over the substrate. The substrate is positioned to the proper x-y location such that when the transfer mechanism moves a chip to the position over the substrate, it will be properly located at the correct part of the substrate circuit. The sticks are indexable as needed to a position presenting the endmost chip of the selected stick underneath the outer extreme of the movement of the vacuum head. Control apparatus positions the substrate in any desired series of x-y locations.