Abstract: A semiconductor chip transferring method and apparatus is described having a movable member, a flexible structure having adhesive on a lower surface thereof, a first transport assembly, and a second transport assembly. The first transport assembly is positioned beneath the support structure and includes a rotatable base upon which is mounted at least one arm. The movable member is extended into and flexes the support structure to transfer a semiconductor chip supported on a first side by the support structure to the arm which supports it on a second side. The first transport assembly moves the chip to the second transport assembly which may, in turn, move it to an output container which supports the second side. The chip has now been inverted from its initial orientation.

Abstract: A laser bar loading and unloading apparatus is disclosed. The apparatus includes a mounting surface, a movable coating fixture having a plurality of spacers, and at least a first vacuum source for providing a vacuum on a laser bar mounted on the mounting surface. The spacers are movable to place a fully loaded fixture in a closed position and to place an empty fixture in an opened position. A second vacuum source directs a vacuum on a laser bar to assist in moving the laser bar into the fixture and onto one of the spacers. A third vacuum source directs a vacuum on the loaded laser bars to maintain their position in the fixture.