Abstract: The present invention provides a process for biomasses. The process may include removing residual moisture from the biomass to provide dried biomass. The dried biomass may be subjected to a basic solution. The biomass may then be heated to a temperature of about 130° F. to about 150° F. for about 30 to 50 minutes. The biomass is then subjected to an oxidation agent for about 40 to 90 minutes. The biomass is then separated into a cellulosic pulp and an extract. The resulting pulp may then be subjected to the basic solution and oxidizing agent a second time. For the terrestrial-based biomasses, the resulting product may be separated into a cellulose rich dissolving grade pulp and an extract high in lignin. For the marine-based biomasses, the resulting product may be separated into a cellulosic-rich pulp and an extract high in sodium alginate.

Abstract: A packaging sheet, which can also be used for packaging other meats, includes a polymer having a microstructure that includes a plurality of closed cells, each cell containing a void and each cell having a maximum dimension extending across the void within the cell that ranges between 1 micrometer and 200 micrometers long. When used to package bacon, the packaging sheet may also include a main portion, a flap pivotable relative to the main portion, a first surface that extends across the main portion and the flap, and that contacts the bacon, a second surface that extends across the main portion and the flap, and that does not contact the bacon, and a thickness that extends from the first surface to the second surface in a direction perpendicular to the first surface.

Abstract: The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.

Abstract: The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.