Patents by Inventor John E. Dowsing, III

John E. Dowsing, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low cost hermetic sealed microwave module packaging
    Patent number: 6028007
    Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: February 22, 2000
    Assignee: TRW Inc.
    Inventors: Steven S. Chan, John E. Dowsing, III, Jason E. Snodgress
  • Low cost hermetic sealed microwave module packaging
    Patent number: 5956840
    Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: September 28, 1999
    Assignee: TRW Inc.
    Inventors: Steven S. Chan, John E. Dowsing, III, Jason E. Snodgress
  • High frequency microelectronic circuit enclosure
    Patent number: 5541565
    Abstract: An enclosure assembly for a high frequency integrated circuit. The enclosure assembly includes a plurality of lead terminals that are part of a lead frame. The lead terminals are connected to electrical ports of the circuit within the enclosure to connect the circuit to other integrated circuits and/or to a printed circuit board. A portion of the lead terminals outside of the enclosure has a specially shaped flared region that establishes the characteristic impedance of the circuit on the lead lines outside of the enclosure.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: July 30, 1996
    Assignee: TRW Inc.
    Inventors: John E. Dowsing, III, Jeffrey M. Edwards, Duncan M. Smith
  • Low dielectric constant interconnect for multichip modules
    Patent number: 5402003
    Abstract: A substrate applicable to be used in a multichip module including a plurality of integrated circuits. The substrate includes a series of interrelated metal layers, ceramic layers and lattice structures formed by the ceramic layers. The metal layers provide ground planes, power planes and interconnects for the integrated circuit. The lattice structure consists of a series of ceramic regions separating the ceramic layers such that the majority of the lattice structure is air in order to reduce the effective dielectric constant of the substrate.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: March 28, 1995
    Assignee: TRW Inc.
    Inventors: George W. McIver, Paula R. Hurt, John E. Dowsing, III