Patents by Inventor John E. Ehrreich

John E. Ehrreich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110061597
    Abstract: A protected feeder is provided for squirrels which comprises a feeder having a self supporting enclosure for predator protection from hawks or foxes to be positioned adjacent a tree for providing a protected perch with access openings in the cover and a selected portion of ground therein is covered with food. The enclosure member is substantially impervious and protects the squirrels while feeding and protects the squirrel from weather. This invention provides various designs for the protected squirrel feeder adapted to protect the food, one using a tray which is smaller than the self supporting enclosure and a second feeder uses small high-calcium loaded rocks as a ground layer.
    Type: Application
    Filed: October 15, 2010
    Publication date: March 17, 2011
    Inventor: John E. Ehrreich
  • Patent number: 7320295
    Abstract: A squirrel house that can be used for shelter from predators, from cold weather and for providing a den for a breeding pair of squirrels to build a nest for raising a family of young squirrels, having a front wall including a side access hole, a floor having a bottom access opening, a pair of matching side walls supporting a shed roof end extending at a slight incline from the back wall to and over the side access wall being supported along the tapered top edges of the side walls. The squirrel house also employs multiple predator guards including a predator guard mounted on the roof, an internal predator guard, an interior baffle to reduce access by a predator, and a roof guard comprising projections on the roof to hinder predator access from the roof, and where there is a separate exit hole for the nesting squirrel(s) to exit while a predator attempts to enter through a predator guard hole.
    Type: Grant
    Filed: May 27, 2006
    Date of Patent: January 22, 2008
    Inventor: John E. Ehrreich
  • Patent number: 7069877
    Abstract: A squirrel house that can be used for shelter from predators, from cold weather and for providing a den for a breeding pair of squirrels to build a nest for raising a family of young squirrels, having a front wall including a side access hole, a floor having a bottom access opening, a pair of matching side walls supporting a shed roof end extending at a slight incline from the back wall to and over the side access wall being supported along the tapered top edges of the side walls.
    Type: Grant
    Filed: February 14, 2004
    Date of Patent: July 4, 2006
    Inventor: John E. Ehrreich
  • Patent number: 4836955
    Abstract: An improved silver-coated copper-based powder which is characterized by extraordinary stability, in terms of electroconductivity, when the powder is utilized with organic resin to form electroconductive compositons. The powder is made by subjecting it to an intensive heat treatment after the silver is coated thereon.
    Type: Grant
    Filed: November 3, 1987
    Date of Patent: June 6, 1989
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4786437
    Abstract: Unfavorable interaction is prevented between (a) electroconductive particle fillers and (b) organic resin binders of the type which are normally instable with respect to viscosity when aged in contact with said fillers. Moreover, electroconductivity degradation is also avoided. In a preferred mode of the invention, the particle surface is treated with a coating of an interfacial pacifying agent such as a tetravalent tin compound which both enhances the electroconductive performance of the particles and also is sufficiently compatible with the resin binder to migrate into the binder sufficiently to avoid undue gelling of the binder by particle-borne contamination or residues of such contamination.
    Type: Grant
    Filed: May 13, 1987
    Date of Patent: November 22, 1988
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4716081
    Abstract: An improved silver-coated copper-based powder which is characterized by extraordinary stability, in terms of electroconductivity, when the powder is utilized with organic resin to form electroconductive compositions. The powder is made by subjecting it to an intensive heat treatment after the silver is coated thereon.
    Type: Grant
    Filed: July 19, 1985
    Date of Patent: December 29, 1987
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4683082
    Abstract: Unfavorable interaction is prevented between (a) electroconductive particle fillers and (b) organic resin binders of the type which are normally instable with respect to viscosity when aged in contact with said fillers. Moreover, electroconductivity degradation is also avoided. In a preferred mode of the invention, the particle surface is treated with a coating of an interfacial pacifying agent such as a tetravalent tin compound which both enhances the electroconductive performance of the particles and also is sufficiently compatible with the resin binder to migrate into the binder sufficiently to avoid undue gelling of the binder by particle-borne contamination or residues of such contamination.
    Type: Grant
    Filed: March 27, 1985
    Date of Patent: July 28, 1987
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4592961
    Abstract: A coating composition having surprisingly superior physical properties, particularly when highly-filled with small particles and bonded to a flexible film of a polymeric substrate. The composition consists essentially of (1) a homogeneous binder formed of relatively hard, high-tensile, aromatic polyester compounded with a vinylidene chloride copolymer such that the copolymer serves as means to increase the elongation, toughness and heat resistance of the binder and (2) the filler. The process of forming such a binder comprises formation of a homogeneous polymeric solution wherein each of the polymers is intimately distributed within the same solvent phase.
    Type: Grant
    Filed: October 9, 1984
    Date of Patent: June 3, 1986
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4435214
    Abstract: Improved compositions of the type using metal flake in resin binders. The distribution of the flakes can be much enhanced using relatively small quantities of an ultra-thin, non-planar metal flake. Enhanced electroconductivity is a particular advantage of the invention.
    Type: Grant
    Filed: June 6, 1983
    Date of Patent: March 6, 1984
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4407674
    Abstract: Novel electrically-conductive compositions comprising an organic resin matrix and flakes of a novel conductive silver powder which is characterized by extreme thinness. The novel silver powder, and a novel process for preparing metal powders, are also described.
    Type: Grant
    Filed: October 2, 1981
    Date of Patent: October 4, 1983
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4319920
    Abstract: Novel electrically-conductive compositions comprising an organic resin matrix and flakes of a novel conductive silver powder which is characterized by extreme thinness. The novel silver powder, and a novel process for preparing metal powders, are also described.
    Type: Grant
    Filed: March 3, 1980
    Date of Patent: March 16, 1982
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: D259777
    Type: Grant
    Filed: October 7, 1977
    Date of Patent: July 7, 1981
    Assignee: Ercon Corporation
    Inventor: John E. Ehrreich