Patents by Inventor John E. Evert

John E. Evert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die-in heat spreader microelectronic package
    Publication number: 20040155325
    Abstract: Microelectronic packages including a microelectronic die disposed within a recess in a heat spreader and build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die and the heat spreader to form the microelectronic package, and methods for the fabrication of the same, including methods to align the microelectronic die within the heat spreader. In another embodiment, a microelectronic die is disposed on a heat spreader which has a filler material disposed therearound and build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die and the filler material to form the microelectronic package, and methods for the fabrication of the same, including methods to align the microelectronic die on the heat spreader.
    Type: Application
    Filed: February 9, 2004
    Publication date: August 12, 2004
    Applicant: Intel Corporation
    Inventors: Qing Ma, Harry H. Fujimoto, Steven Towle, John E. Evert
  • Die-in-heat spreader microelectronic package
    Patent number: 6709898
    Abstract: Microelectronic packages including a microelectronic die disposed within a recess in a heat spreader and build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die and the heat spreader to form the microelectronic package, and methods for the fabrication of the same, including methods to align the microelectronic die within the heat spreader. In another embodiment, a microelectronic die is disposed on a heat spreader which has a filler material disposed therearound and build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die and the filler material to form the microelectronic package, and methods for the fabrication of the same, including methods to align the microelectronic die on the heat spreader.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: March 23, 2004
    Assignee: Intel Corporation
    Inventors: Qing Ma, Harry H. Fujimoto, Steven Towle, John E. Evert