Patents by Inventor John E. Fritz, Jr.

John E. Fritz, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transistor cooling by heat pipes
    Patent number: 4106188
    Abstract: A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure. Electrical leads extend from the electronic devices and circuitry to the outside of the enclosure to couple the devices and circuitry into a larger electrical function. A dielectric powder is adhered as a complete and conformal coating substantially to all interior surfaces of the enclosure and to all exposed surfaces of the electronic devices and circuitry, and functions as a heat pipe wick. A dielectric working fluid within the enclosure, therefore, can intimately contact all the interior and exposed surfaces to minimize the occurrence of local hot spots on the electronic devices and circuitry and to maximize heat transfer therefrom to the external heat sink.
    Type: Grant
    Filed: July 1, 1977
    Date of Patent: August 15, 1978
    Assignee: Hughes Aircraft Company
    Inventors: Kalwant S. Sekhon, Lloyd A. Nelson, John E. Fritz, Jr.
  • Transistor cooling by heat pipes having a wick of dielectric powder
    Patent number: 4047198
    Abstract: A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure. Electrical leads extend from the electronic devices and circuitry to the outside of the enclosure to couple the devices and circuitry into a larger electrical function. A dielectric powder is adhered as a complete and conformal coating substantially to all interior surfaces of the enclosure and to all exposed surfaces of the electronic devices and circuitry, and functions as a heat pipe wick. A dielectric working fluid within the enclosure, therefore, can intimately contact all the interior and exposed surfaces to minimize the occurrence of local hot spots on the electronic devices and circuitry and to maximize heat transfer therefrom to the external heat sink.
    Type: Grant
    Filed: April 19, 1976
    Date of Patent: September 6, 1977
    Assignee: Hughes Aircraft Company
    Inventors: Kalwant S. Sekhon, Lloyd A. Nelson, John E. Fritz, Jr.