Abstract: An anti-rotational push to connect fitting includes a housing defining an internal cavity, the internal cavity having, at least in part, a non-circular shape. The housing has a conduit receiving region having an inwardly oriented wall. A seal is positioned in the housing adjacent to the conduit receiving region. A grip ring support is positioned in the housing adjacent to the seal. The grip ring support has a transverse flange having an inner peripheral edge and an outer peripheral edge and a longitudinal wall extending from the flange spaced from the inner and outer peripheral edges to define gaps between the longitudinal wall and a wall of the housing and inwardly of the longitudinal wall. A grip ring is positioned adjacent to the grip ring support and is seated on an end of the wall. The grip ring has a non-circular shape configured to cooperate with the housing internal cavity and the grip ring support.

Abstract: An anti-rotational push to connect fitting includes a housing defining an internal cavity, the internal cavity having, at least in part, a non-circular shape. The housing has a conduit receiving region having an inwardly oriented wall. A seal is positioned in the housing adjacent to the conduit receiving region. A grip ring support is positioned in the housing adjacent to the seal. The grip ring support has a transverse flange having an inner peripheral edge and an outer peripheral edge and a longitudinal wall extending from the flange spaced from the inner and outer peripheral edges to define gaps between the longitudinal wall and a wall of the housing and inwardly of the longitudinal wall. A grip ring is positioned adjacent to the grip ring support and is seated on an end of the wall. The grip ring has a non-circular shape configured to cooperate with the housing internal cavity and the grip ring support.

Abstract: An electrically conductive material coated with a plurality of layers, includes a metal or metal alloy substrate; a barrier layer deposited on said substrate effective to inhibit diffusion of constituents of said substrate to said plurality of layers; a sacrificial layer deposited on said barrier layer effective to form intermetallic compounds with tin; a low resistivity oxide metal layer deposited on said sacrificial layer; and an outermost layer of tin or a tin-base alloy directly deposited on said low resistivity oxide metal layer.

Abstract: A coated electrically conductive substrate has particular utility where there are multiple closely spaced leads and tin whiskers constitute a potential short circuit. Such substrates include leadframes, terminal pins and circuit traces such as on printed circuit boards and flexible circuits. This electrically conductive substrate has a plurality of leads separated by a distance capable of bridging by a tin whisker, a silver or silver-base alloy layer coating at least one surface of at least one of the plurality of leads, and a fine grain tin or tin-base alloy layer directly coating said silver layer. An alternative coated electrically conductive substrate has particular utility where debris from fretting wear may oxidize and increase electrical resistivity, such an in a connector assembly. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of constituents the substrate into a plurality of subsequently deposited layers.

Abstract: A coated electrically conductive substrate has particular utility where there are multiple closely spaced leads and tin whiskers constitute a potential short circuit. This electrically conductive substrate has a plurality of leads separated by a distance capable of bridging by a tin whisker, a silver or silver-base alloy layer coating at least one surface of at least one of the plurality of leads, and a fine grain tin or tin-base alloy layer directly coating said silver layer. An alternative coated electrically conductive substrate has utility where debris from fretting wear may increase electrical resistivity. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of the substrate into a subsequently deposited layers, which include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, and a low resistivity oxide metal layer deposited on the sacrificial layer.