Patents by Inventor John E. Gregory, Jr.

John E. Gregory, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier die with micro channel cooling and embedded components
    Patent number: 12696808
    Abstract: A three-dimensional (3D) integrated circuit (IC) includes a plurality of dies, a carrier die, and a plurality of channels embedded in the carrier die. The plurality of dies is stacked in the 3D IC. Each of the dies includes circuitry. The carrier die is disposed above the stacked dies in the 3D IC. The carrier die is configured to provide mechanical support to the stacked dies in the 3D IC. The plurality of channels is configured to carry a coolant to cool the 3D IC.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: July 28, 2026
    Assignee: MARVELL ASIA PTE LTD
    Inventors: John E. Gregory, Jr., Eva Shah Holmes, Carlos Macian Ruiz, Mark William Kuemerle, Wolfgang Sauter, Aatreya Chakravarti, Samer Michael Akiki