Patents by Inventor John E. Henderson

John E. Henderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968776
    Abstract: Disclosed is a method of assembling a backplane connector subassembly for a module of a modular energy system. The backplane connector subassembly physically and electrically connects at least two modules stacked on top of one another. The method includes providing a back panel defining an inner surface, attaching a first support member to the inner surface of the back panel, attaching a second support member to the inner surface of the back panel, attaching the upstream connector to the back panel by sliding a first mating hole defined in the upstream connector onto the first support member, and attaching the downstream connector to the back panel by a sliding a second mating hole defined in the downstream connector onto the second support member. The first support member is configured to support an upstream connector. The second support member is configured to support a downstream connector.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: April 23, 2024
    Assignee: Cilag GmbH International
    Inventors: Madeleine C. Jayme, Ryan M. Asher, William B. Weisenburgh, II, Joshua E. Henderson, Stephen D. Geresy, Stephen M. Leuck, John A. Weed, III, Brendan J. Oberkircher, Kristen G. Denzinger
  • Patent number: 5549773
    Abstract: Preimpregnated thermoplastic yarn is interwoven around spaced hex mandrels as weft members in a preformed ribbon, which may be folded into layers or cut into sheets for stacking in a honeycomb pattern in preparation for bonding. In block bonding, pressure and heat are applied to an entire fully stacked block to bond the interface facets together and form hex ducts around the mandrels, which must then be extracted, typically individually in a special pneumatic press process. In a preferred layer bonding process certain problems and limitations of block bonding are overcome by bonding each sheet as it is added to a stack buildup. An alternate layer bonding process is disclosed, which is facilitated by magnetic pressing, using electromagnets acting on ferrous mandrels to apply pressure evenly distributed along interfacial facets during thermal fusion bonding. The magnetically pressed layer bonding process is readily automated by disclosed apparatus. Heating and cooling are provided to the mandrels.
    Type: Grant
    Filed: January 23, 1995
    Date of Patent: August 27, 1996
    Assignee: Northrop Grumman Corporation
    Inventors: John E. Henderson, John K. Narasaki
  • Patent number: 4037457
    Abstract: A support table for a pipe bender is disclosed. The table includes a pair of upright supports, each having apertures to pivotally mount one end of a pipe bender. The table includes a pair of rails having a member for supporting a pipe slidably mounted thereon. The side rails are mounted for vertical and level adjustment so that a pipe can be leveled on the table for positioning during bending.
    Type: Grant
    Filed: September 17, 1975
    Date of Patent: July 26, 1977
    Inventor: John E. Henderson