Patents by Inventor John E. Lopata

John E. Lopata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7298628
    Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: November 20, 2007
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, John E. Lopata, James L. McGrath, Arindum Dutta
  • Patent number: 7165981
    Abstract: A termination structure for mating a cable connector to a circuit board has a ground terminal and two signal terminals arranged in triangular pattern through the connector in order to reduce the impedance through the connector. The width of the ground terminal increases along its extent with respect to the signal terminals. This increase occurs along either a transition or contact portion of the ground terminal.
    Type: Grant
    Filed: July 25, 2005
    Date of Patent: January 23, 2007
    Assignee: Molex Incorporated
    Inventors: Maxwill P. Bassler, David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata
  • Patent number: 7160154
    Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: January 9, 2007
    Assignee: Molex Incorporated
    Inventors: David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata, Arindum Dutta
  • Patent number: 7095619
    Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: August 22, 2006
    Assignee: Molex Incorporated
    Inventors: Augusto P. Panella, John E. Lopata, James L. McGrath, Arindum Dutta
  • Patent number: 7061342
    Abstract: An engineered transmission line for transmitting high-frequency data signals between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body. Enlarged conductive surfaces may also be provided on the body which have a greater surface area than those intended for use with the signal channels. The enlarged surfaces are utilized to carry power.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: June 13, 2006
    Assignee: Molex Incorporated
    Inventors: David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata, Arindum Dutta
  • Patent number: 6990733
    Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: January 31, 2006
    Assignee: Molex Incorporated
    Inventors: John E. Lopata, James L. McGrath, Arindum Dutta, Marvin Menzin, Daniel Fisher, Jr.
  • Patent number: 6976881
    Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: December 20, 2005
    Assignee: Molex Incorporated
    Inventors: David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata, Arindum Dutta
  • Patent number: 6953347
    Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
    Type: Grant
    Filed: November 6, 2003
    Date of Patent: October 11, 2005
    Assignee: Molex Incorporated
    Inventors: James L. McGrath, John E. Lopata, Arindum Dutta, Marvin Menzin, Daniel Fisher, Jr.
  • Patent number: 6945796
    Abstract: A termination structure for mating a cable connector to a circuit board has a ground terminal and two signal terminals arranged in triangular pattern through the connector in order to reduce the impedance through the connector. The width of the ground terminal increases along its extent with respect to the signal terminals. This increase occurs along either a transition or contact portion of the ground terminal.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: September 20, 2005
    Assignee: Molex Incorporated
    Inventors: Maxwill P. Bassler, David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata
  • Patent number: 6936917
    Abstract: A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: August 30, 2005
    Assignee: Molex Incorporated
    Inventors: John E. Lopata, Augusto P. Panella, Arindum Dutta, James L. McGrath
  • Patent number: 6840810
    Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: January 11, 2005
    Assignee: Molex Incorporated
    Inventors: David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata, Arindum Dutta
  • Publication number: 20040198082
    Abstract: A method of forming an electrical connector is provided. A mask having recesses is provided and solder is dispensed into the recesses. Contact tails from terminals in a connector are positioned below the mask and aligned with the recesses of the mask such that the contact tails either abut against the solder or are in close proximity thereto. As the solder is heated, it melts and flows onto the contact tails and forms masses of solder on the contact tails. The masses of solder are then allowed to cool and harden on the contact tails and the mask is removed. An electrical connector with the masses of solder connected thereto is thus provided.
    Type: Application
    Filed: April 7, 2003
    Publication date: October 7, 2004
    Inventors: Victor Zaderej, Arindum Dutta, John E. Lopata
  • Publication number: 20040163250
    Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
    Type: Application
    Filed: February 20, 2004
    Publication date: August 26, 2004
    Inventors: John E. Lopata, James L. McGrath, Arindum Dutta, Marvin Menzin, Daniel Fisher
  • Publication number: 20040113711
    Abstract: An engineered transmission line for transmitting high-frequency data signal s between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body.
    Type: Application
    Filed: December 27, 2002
    Publication date: June 17, 2004
    Inventors: David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata, Arindum Dutta
  • Publication number: 20040092143
    Abstract: A termination structure for mating a cable connector to a circuit board includes a plurality of associated sets of terminals, each terminal set including a pair of differential signal terminals and a ground reference terminal. Each associated set of terminals is arranged in triangular pattern through the connector in order to reduce the impedance through the connector, and adjacent associated terminal sets are inverted so that the ground reference terminals of alternating associated terminal sets are located along one row of the connector along with signal terminals of intervening terminal sets, while the ground reference terminals of intervening terminal sets are located along a second row of the connector, along with the signal terminals of alternating associated terminal sets. This inverted arrangement increases the density of the connector.
    Type: Application
    Filed: December 22, 2003
    Publication date: May 13, 2004
    Inventors: Galen Fromm, David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata
  • Patent number: 6722896
    Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: April 20, 2004
    Assignee: Molex Incorporated
    Inventors: James L. McGrath, John E. Lopata, Arindum Dutta, Marvin Menzin, Daniel Fisher, Jr.
  • Patent number: 6694609
    Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: February 24, 2004
    Assignee: Molex Incorporated
    Inventors: John E. Lopata, James L. McGrath, Arindum Dutta, Marvin Menzin, Daniel Fisher, Jr.
  • Publication number: 20030198033
    Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.
    Type: Application
    Filed: February 25, 2003
    Publication date: October 23, 2003
    Inventors: Augusto P. Panella, John E. Lopata, James L. McGrath, Arindum Dutta
  • Publication number: 20030179050
    Abstract: An engineered transmission line for transmitting high-frequency data signal s between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body. Enlarged conductive surfaces may also be provided on the body which have a greater surface area than those intended for use with the signal channels. The enlarged surfaces are utilized to carry power.
    Type: Application
    Filed: December 27, 2002
    Publication date: September 25, 2003
    Inventors: David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata, Arindum Dutta
  • Publication number: 20030181104
    Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.
    Type: Application
    Filed: December 30, 2002
    Publication date: September 25, 2003
    Inventors: David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata, Arindum Dutta