Patents by Inventor John E. McConnell
John E. McConnell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230038175Abstract: Provided is an electronic module comprising at least one electronic component. A thermoelectric cooler is in thermal contact with the electronic component. A temperature controller is capable of determining a device temperature of the electronic component is provided and capable of providing current to the thermoelectric cooler proportional to a deviation of the device temperature from an optimal temperature range.Type: ApplicationFiled: October 18, 2022Publication date: February 9, 2023Inventors: John E. McConnell, John Bultitude, Allen Templeton
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Patent number: 11432448Abstract: A method of forming an electronic device is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.Type: GrantFiled: June 17, 2020Date of Patent: August 30, 2022Assignee: KEMET Electronics CorporationInventors: John E. McConnell, John Bultitude
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Patent number: 11227719Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.Type: GrantFiled: March 1, 2018Date of Patent: January 18, 2022Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Garry L Renner, John Bultitude, Allen Hill
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Patent number: 10984955Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.Type: GrantFiled: June 12, 2019Date of Patent: April 20, 2021Assignee: KEMET Electronics CorporationInventors: John Bultitude, John E. McConnell, Galen W. Miller
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Publication number: 20200323112Abstract: An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.Type: ApplicationFiled: June 17, 2020Publication date: October 8, 2020Inventors: John E. McConnell, John Bultitude
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Patent number: 10790094Abstract: A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.Type: GrantFiled: June 28, 2019Date of Patent: September 29, 2020Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
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Patent number: 10757810Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.Type: GrantFiled: November 19, 2018Date of Patent: August 25, 2020Assignee: KEMET Electronics CorporationInventors: John Bultitude, Galen Miller, John E. McConnell
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Patent number: 10729051Abstract: An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.Type: GrantFiled: June 20, 2016Date of Patent: July 28, 2020Assignee: KEMET Electronics CorporationInventors: John E. McConnell, John Bultitude
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Patent number: 10707145Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.Type: GrantFiled: November 6, 2017Date of Patent: July 7, 2020Assignee: KEMET Electronics CorporationInventors: John Bultitude, Galen Miller, John E. McConnell
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Publication number: 20190318877Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elementsType: ApplicationFiled: June 28, 2019Publication date: October 17, 2019Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
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Publication number: 20190304698Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.Type: ApplicationFiled: June 12, 2019Publication date: October 3, 2019Inventors: John Bultitude, John E. McConnell, Galen W. Miller
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Patent number: 10381162Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.Type: GrantFiled: August 7, 2017Date of Patent: August 13, 2019Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
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Patent number: 10366836Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.Type: GrantFiled: October 4, 2016Date of Patent: July 30, 2019Assignee: KEMET Electronics CorporationInventors: John Bultitude, John E. McConnell, Galen W. Miller
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Publication number: 20190090348Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.Type: ApplicationFiled: November 19, 2018Publication date: March 21, 2019Inventors: John Bultitude, Galen Miller, John E. McConnell
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Publication number: 20190080982Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.Type: ApplicationFiled: November 6, 2017Publication date: March 14, 2019Inventors: John Bultitude, Galen Miller, John E. McConnell
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Patent number: 10229785Abstract: An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.Type: GrantFiled: December 4, 2013Date of Patent: March 12, 2019Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey W. Bell
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Patent number: 10224149Abstract: Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.Type: GrantFiled: September 13, 2016Date of Patent: March 5, 2019Assignee: KEMET Electronics CorporationInventors: Galen W. Miller, John E. McConnell, John Bultitude, Garry L. Renner
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Patent number: 10068707Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.Type: GrantFiled: October 28, 2015Date of Patent: September 4, 2018Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Garry L. Renner, John Bultitude, Allen Hill
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Publication number: 20180190430Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.Type: ApplicationFiled: March 1, 2018Publication date: July 5, 2018Inventors: John E. McConnell, Garry L. Renner, John Bultitude, Allen Hill
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Patent number: D1022359Type: GrantFiled: March 8, 2022Date of Patent: April 9, 2024Assignee: Whirlpool CorporationInventors: Seth E. Bixby, Samuel B. Breneman, Richard K. Gresens, John W. McConnell, Patrick J. Schiavone