Patents by Inventor John E. Nicholson

John E. Nicholson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11920039
    Abstract: Derivatized malachite green leuco dyes for use in radio-chromic systems are described. The dyes have the following structure: in which Ar is a substituted phenyl or thiophene ring in which at least one substitution of the Ar ring is not ortho to the bond between the ring and the linking carbon, and in which R1, R2, R3, and R4 are independently selected from methyl, alkyl, or alkyl halide. The systems include the dyes in conjunction with an activator, e.g., a halogenated activator, and a carrier, e.g., a fluid carrier or an encapsulating polymeric matrix.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: March 5, 2024
    Assignees: Battelle Savannah River Alliance, LLC, University of Kentucky Research Foundation
    Inventors: Aaron L. Washington, II, John T. Bobbitt, III, John E. Anthony, Brent Peters, James C. Nicholson
  • Patent number: 11914989
    Abstract: Techniques for specifying and implementing a software application targeted for execution on a multiprocessor array (MPA). The MPA may include a plurality of processing elements, supporting memory, and a high bandwidth interconnection network (IN), communicatively coupling the plurality of processing elements and supporting memory. In some embodiments, software code may specify one or more cell definitions that include: program instructions executable to perform a function and one or more language constructs. The software code may further instantiate first, second, and third cell instances, each of which is an instantiation of one of the one or more cell definitions, where the instantiation includes configuration of the one or more language constructs such that: the first and second cell instances communicate via respective communication ports and the first and second cell instances are included in the third cell instance.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: February 27, 2024
    Assignee: Coherent Logix, Incorporated
    Inventors: Stephen E. Lim, Viet N. Ngo, Jeffrey M. Nicholson, John Mark Beardslee, Teng-I Wang, Zhong Qing Shang, Michael Lyle Purnell
  • Patent number: 8290593
    Abstract: An implantable medical device (IMD) may include at least two separate lead connection assemblies, each with electrical connectors for connecting implantable leads to the IMD. In some examples, a IMD may include a first therapy module configured to generate a first electrical stimulation therapy and a second therapy module configured to generate a second electrical stimulation therapy for delivery to the patient. The IMD may include a first lead connection assembly including a first electrical connector electrically coupled to the first therapy module and a second lead connection assembly including a second electrical connector electrically coupled to the second therapy module. In some examples, the first and second lead connection assemblies are distributed around the outer perimeter of the IMD housing.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: October 16, 2012
    Assignee: Medtronic, Inc.
    Inventors: Robert W. Libbey, William T. Donofrio, John E. Burnes, Paul G. Krause, Michael K. Berquist, Olivier Blandin, Michael Hudziak, William L. Johnson, John E. Nicholson, George Patras, Andrew J. Ries, Jeffrey Swanson, Paul Vahle, Thomas J. Olson, William K. Wenger, Michael R. Klardie, Samira Tahvildari
  • Patent number: 7881765
    Abstract: Apparatus and method according to the disclosure relate to minimizing gaps between a substantially planar cardiac-sensing electrode and a shroud member utilizing a so-called interference-fit. For example, a relatively recessed area or aperture formed in an exemplary resin-based shroud member has slightly reduced dimensions relative to the electrode and requires compression forces during assembly (e.g., manually or in an automated process including a press, a tool or other means). The interference-fit promotes a very tight fit (or seal) between the metallic electrode and the resin-based shroud member and, importantly, minimizes gaps. Additionally, discrete interference structures promote fluid tight seals between the electrode and a recess or aperture adapted to receive the electrode.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: February 1, 2011
    Assignee: Medtronic, Inc.
    Inventors: John C. Mertz, Bryan J. Zart, James Strom, Michael D. Fletcher, John E. Nicholson, Steven J. Fischer
  • Publication number: 20100285697
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: July 21, 2010
    Publication date: November 11, 2010
    Applicant: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Publication number: 20100187206
    Abstract: A terminal platform comprising a first terminal block securable to a housing of the battery, a second terminal block configured to electrically connect to a terminal wire of the battery, and an insulating support electrically isolating the second terminal block from the first terminal block.
    Type: Application
    Filed: March 19, 2010
    Publication date: July 29, 2010
    Inventors: Jennifer J. Zhao, Thomas Ceballos, James Strom, Richard A. Bruchmann, John E. Nicholson, Scott J. Robinson, Bernard F. Heller, JR.
  • Publication number: 20100137929
    Abstract: An implantable medical device (IMD) may include at least two separate lead connection assemblies, each with electrical connectors for connecting implantable leads to the IMD. In some examples, a IMD may include a first therapy module configured to generate a first electrical stimulation therapy and a second therapy module configured to generate a second electrical stimulation therapy for delivery to the patient. The IMD may include a first lead connection assembly including a first electrical connector electrically coupled to the first therapy module and a second lead connection assembly including a second electrical connector electrically coupled to the second therapy module. In some examples, the first and second lead connection assemblies are distributed around the outer perimeter of the IMD housing.
    Type: Application
    Filed: October 30, 2009
    Publication date: June 3, 2010
    Applicant: Medtronic, Inc.
    Inventors: Robert W. Libbey, William T. Donofrio, John E. Burnes, Paul G. Krause, Michael K. Berquist, Olivier Blandin, Michael Hudziak, William L. Johnson, John E. Nicholson, George Patras, Andrew J. Ries, Jeffrey Swanson, Paul Vahle, Thomas J. Olson, William K. Wenger, Michael R. Klardie, Samira Tahvildari
  • Patent number: 7713656
    Abstract: A terminal platform comprising a first terminal block securable to a housing of the battery, a second terminal block configured to electrically connect to a terminal wire of the battery, and an insulating support electrically isolating the second terminal block from the first terminal block.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: May 11, 2010
    Assignee: Medtronic, Inc.
    Inventors: Jennifer J. Zhao, Thomas Ceballos, James Strom, Richard A. Bruchmann, John E. Nicholson, Scott J. Robinson, Bernard F. Heller, Jr.
  • Patent number: 7493166
    Abstract: An implantable medical device has one or more feedthrough/electrode assemblies positioned around an outer periphery of the device. Each of the assemblies includes a ferrule and a feedthrough conductor that extends longitudinally through the ferrule. Each of the assemblies also includes a cover having an insulative body and an electrical contact that is mounted to the plastic insulator. The plastic insulator is positioned over an inner end of the assembly such that the contact is operatively coupled to the feedthrough conductor of the assembly. The cover can be oriented so as to be freely accessible for purposes of electrically connecting circuitry within the implantable medical device to the contact, and in turn, the feedthrough conductor. In turn, the wiring used in connecting the circuitry and the contact can be routed within the implantable medical device as desired.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: February 17, 2009
    Assignee: Medtronic, Inc.
    Inventors: John E. Nicholson, James Strom, William D. Wolf
  • Publication number: 20090017700
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: September 24, 2008
    Publication date: January 15, 2009
    Applicant: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 7472505
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: January 6, 2009
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 7309262
    Abstract: A connector assembly for coupling to an implantable medical device includes a core element formed of a first thermoplastic material shaped to receive a connector member for receiving a lead. The connector assembly further includes a circuit member positioned adjacent to the core element. The circuit member includes a portion extending along the core element to the connector member and an antenna structure extending over a portion of the core element outer surface.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: December 18, 2007
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Andrew J. Ries, Brian R. Burwick, John E. Nicholson, Jay K. Lahti, Gregory A. Theis
  • Patent number: 7175482
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: February 13, 2007
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 6931284
    Abstract: An implantable medical device that includes an enclosure, an electrical module for the desired stimulation, sensing and communications functions, a power source, an air-core antenna, and supporting structures therefore. The antenna includes a quarter-elliptical shape that maximizes the antenna area to facilitate transmission of electromagnetic waves through the enclosure. A support structure is provided so that the antenna, the module and the battery self-align with each other and the enclosure. The support structure contains contacts to facilitate electrical connection of the antenna to the module and positions the module so that contacts thereon are in close proximity in plan and elevation to external electrical feed-throughs in the housing and the antenna contacts on the support structure.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: August 16, 2005
    Assignee: Medtronic, Inc.
    Inventors: David B. Engmark, John E. Nicholson, Brian S. Child, David M. Reinker
  • Patent number: 6817905
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: November 16, 2004
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Publication number: 20040082977
    Abstract: An implantable medical device that includes an enclosure, an electrical module for the desired stimulation, sensing and communications functions, a power source, an air-core antenna, and supporting structures therefore. The antenna includes a quarter-elliptical shape that maximizes the antenna area to facilitate transmission of electromagnetic waves through the enclosure. A support structure is provided so that the antenna, the module and the battery self-align with each other and the enclosure. The support structure contains contacts to facilitate electrical connection of the antenna to the module and positions the module so that contacts thereon are in close proximity in plan and elevation to external electrical feed-throughs in the housing and the antenna contacts on the support structure.
    Type: Application
    Filed: October 25, 2002
    Publication date: April 29, 2004
    Inventors: David B. Engmark, John E. Nicholson, Brian S. Child, David M. Reinker
  • Publication number: 20030069612
    Abstract: An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts.
    Type: Application
    Filed: June 20, 2001
    Publication date: April 10, 2003
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 6522915
    Abstract: The invention discloses a subcutaneous electrode array or SEA for use in medical devices. The arrangement provides an enhanced capability for detecting and gathering electrical cardiac signals via the array of relatively closely spaced subcutaneous electrodes. Further, switching circuits, signal processors and memory to process electric cardiac signals are implemented to enable a leadless orientation-insensitive SEA scheme for receiving the electrical signal from the heart. The SEA is distributed over the perimeter of the implanted medical device and includes a non-conductive surround shroud of biocompatible material. The surround shroud is placed around the periphery of the case of the implanted medical device. Various configurations of recesses, each of which contain individual electrodes, are implemented to provide an enhanced signal to noise ratio for improved signal quality.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: February 18, 2003
    Assignee: Medtronic, Inc.
    Inventors: Thomas I. Ceballos, John E. Nicholson, Eric J. Panken, James D. Reinke, James Strom, Kevin K. Tidemand
  • Patent number: 5535097
    Abstract: An implantable medical device including a hermetic housing containing an electronic circuit, such as a cardiac pacemaker. The electronic circuit may be coupled to a medical lead by means of a connector module which is formed as part of a molded, resilient shroud, extending around the circumference of the hermetic container.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: July 9, 1996
    Assignee: Medtronic, Inc.
    Inventors: David A. Ruben, Jeffrey L. Galvin, Bill R. Simmons, Lourdes O. Kline, Lynn M. Seifried, Craig L. Wiklund, John E. Nicholson, Thomas M. Nutzman
  • Patent number: 5431695
    Abstract: An implantable medical device including a hermetic housing containing an electronic circuit, such as a cardiac pacemaker. The electronic circuit may be coupled to a medical lead by means of a connector module which is formed as part of a molded, resilient shroud, extending around the circumference of the hermetic container.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: July 11, 1995
    Assignee: Medtronic, Inc.
    Inventors: Craig L. Wiklund, Daniel A. Lyons, Eric M. Rieder, John E. Nicholson, Randy C. Schulhauser