Abstract: An apparatus and method for removing contaminant species from water by electrocoagulation are described. Alternating grounded, rotating, planar circular electrodes and stationary planar electrodes function as a Tesla fluid pump when placed in contact with the contaminated water, causing the water to flow between the rotating and stationary electrodes. An insoluble abrasive material introduced into the water removes scale from the electrodes while the water is pumped thereby. A direct electric current is caused to flow between each pair of rotating and stationary electrodes, thereby producing electrocoagulation of the contaminants in the water flowing therebetween. The electrocoagulated materials may be separated from the treated water by filtration or by permitting the treated water to stand for a chosen period.

Abstract: A pressure differential containment structure, including a vacuum chamber and a pressure vessel, for operation in the pressure range of 1 to 2 atmospheres of pressure differential, using relatively thin wall material and incorporating strengthening members by folding or forming the walls of the containment structure itself. The structural configuration of the preferred embodiment is of rectilinear geometry with four lateral walls and two end walls. Each lateral wall component is preferably fabricated from at least one sheet, such as stainless steel, aluminum, or synthetic material including polymers and composites, to comprise reinforcing ribs or corrugations transverse to the longitudinal direction of the wall and include transverse flanges at each end.

Abstract: An apparatus and method for improved plasma treating of circuit boards is disclosed wherein a plasma treating zone and a gas resupply zone are established in a chamber, an actuating mechanism being provided to establish relative movement between the circuit boards and the zones during treatment of the circuit boards. The apparatus preferably includes a chamber for receipt of a gas and having electrodes centrally positioned therein for generating an electrical field at a central portion of the chamber thereby exciting the gas thereat and creating a zone of intense plasma.

Abstract: A process is disclosed for forming a printed circuit board having improved adhesion of an electrically conductive layer to an underlying dielectric surface. A thin adhesive layer, or film, of conductive material (normally copper) is sputtered onto a dielectric substrate and through holes formed therein, after which the substrate, with the then amorphous sputtered layer thereon, is further processed in a manner so as not to damage adhesion of the sputtered layer to the substrate. The initial step of this further processing can be accomplished chemically or mechanically, and preferably is accomplished by electroplating a buffer, or transition, layer of conductive material onto the sputtered layer with the buffer layer being deposited by placing the substrate, having the sputtered layer thereon, in a first electroplating bath to produce an electroplated layer having no deposit stress or a slightly compressive deposit stress.

Abstract: An improved method is disclosed for forming a printed circuit board. The desired printed circuit is established on the surface of a plastic core sheet by placing recesses therein conforming to the desired circuit, and a conductive coating is then applied so that the coating is retained at the recesses. Circuit patterns are preferably pressed into one or both sides of the plastic core sheet, and holes can be placed through the sheet to allow circuit connections between the patterns on the opposite sides of the sheet and to receive electrical leads of circuit components. A thin conductive coating is applied by vacuum deposition, and can be thickness enhanced by electroplating.