Abstract: An image capture device includes a plurality of stacked ceramic circuit boards, an image sensor, signal conditioning electronics, and a connector. Each ceramic circuit board is parallel and directly coupled to at least one other circuit board. The image sensor is mounted to a first ceramic circuit board. The signal conditioning electronics are mounted to one or more of the stacked ceramic circuit boards and are coupled to receive electrical signals generated by the image sensor. The image capture device is enclosed by a shaft and the stacked ceramic circuit boards are stacked along a length of the shaft. The connector is mounted to a second ceramic circuit board that is on an opposite side of the plurality of stacked ceramic circuit boards from the first ceramic circuit board. The connector is mounted to a side of the second ceramic circuit board facing away from the first ceramic circuit board.

Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

Abstract: An optical element is aligned on a flexure by applying multiple laser pulses to the flexure. Additional laser pulses are applied until the optical element is aligned properly.

Abstract: Fluxless laser soldering methods are used to securely bond an optical or microelectronic component to a substrate. A component is aligned on a substrate. The substrate comprises solder dams in joint areas and solder is placed in the joint areas between the dams and the component. Oxygen is evacuated from the joint areas such as by a vacuum or by filling the area with a gas. Lasers may be fired simultaneously or sequentially at the solder in each of the joint areas to reflow the solder. When the solder re-solidifies a strong bond is created securing the component to the substrate.

Abstract: A laser apparatus wherein all optical components are mounted on a unitary, rigid base. Natural frequency modes of the apparatus are above about 2 kHz. Tuning elements in the apparatus may have natural frequencies greater than about 10 kHz.

Abstract: An external cavity laser in a hermetically sealed container and methods for hermetically sealing the external cavity laser. The external cavity laser may be tunable by various mechanisms to allow transmission at multiple selectable wavelength channels.

Abstract: A micro optical bench for mounting precision aligned optics thereon, and an assembly of precision aligned optical components mounted on an micro optical bench.

Abstract: An optical element is aligned on a flexure by applying multiple laser pulses to the flexure. Additional laser pulses are applied until the optical element is aligned properly.

Abstract: A micro optical bench for mounting precision aligned optics thereon, and an assembly of precision aligned optical components mounted on an micro optical bench.

Abstract: An external cavity laser in a hermetically sealed container and methods for hermetically sealing the external cavity laser. The external cavity laser may be tunable by various mechanisms to allow transmission at multiple selectable wavelength channels.

Abstract: A transducer suspension system has a transducer head, laminated member, and a load beam. The laminated member is comprised of a support layer, an electrically insulating layer, and an electrically conducting layer. The electrical lines are formed directly into the laminated member. A first end of the support layer has an aperture into which a tongue section protrudes. The transducer head is attached to the tongue section. A platform section is formed between the aperture and the end of the support layer. The electrical lines run to the transducer head along the platform section. The load beam is attached to the laminated member and provides rigid support. The load beam has an aperture located directly above the platform section and provides access to allow clamping of the electrical lines and the platform section during electrical attachment of the lines to the transducer head. Precise electrical attachment is achieved without unwanted bending of the delicate flexure section of the suspension.

Abstract: A transducer suspension system has a transducer head, laminated member, and a load beam. The laminated member is comprised of a support layer, an electrically insulating layer, and an electrically conducting layer. The electrical lines are formed directly into the laminated member. A first end of the support layer has an aperture into which a tongue section protrudes. The transducer head is attached to the tongue section. A platform section is formed between the aperture and the end of the support layer. The electrical lines run to the transducer head along the platform section. The load beam is attached to the laminated member and provides rigid support. The load beam has an aperture located directly above the platform section and provides access to allow clamping of the electrical lines and the platform section during electrical attach of the lines to the transducer head. Precise electrical attachment is achieved without unwanted bending of the delicate flexure section of the suspension.