Abstract: A stainless steel dual stage actuated disk drive head suspension baseplate including a plated electrical contact area having nickel and gold. The baseplate can be heat treated. The nickel and gold can be in a mixture.

Abstract: A stainless steel dual stage actuated disk drive head suspension baseplate including a plated electrical contact area having nickel and gold. The baseplate can be heat treated. The nickel and gold can be in a mixture.

Abstract: A stainless steel dual stage actuated disk drive head suspension baseplate including a plated electrical contact area having nickel and gold. The baseplate can be heat treated. The nickel and gold can be in a mixture.

Abstract: Stable, low resistance conductive adhesive ground connections between motor contacts and a gold-plated contact area on a stainless steel component of a dual stage actuated suspension. The stainless steel component can be a baseplate, load beam, hinge, motor plate, add-on feature or flexure.

Abstract: Stable, low resistance conductive adhesive ground connections between motor contacts and a gold-plated contact area on a stainless steel component of a dual stage actuated suspension. The stainless steel component can be a baseplate, load beam, hinge, motor plate, add-on feature or flexure.

Abstract: Stable, low resistance conductive adhesive ground connections between motor contacts and a gold-plated contact area on a stainless steel component of a dual stage actuated suspension. The stainless steel component can be a baseplate, load beam, hinge, motor plate, add-on feature or flexure.

Abstract: A computer system having a highly parallel system architecture with multiple central processing units, multiple core logic chipsets and pooled system memory is provided with one or more AGP ports capable of connection to AGP devices. A memory manager is provided within the operating system for allocating pooled memory resources without regard to the location of that memory. A method is presented for dynamically allocating memory for the AGP device that is located on the same core logic chipset to which the AGP device is connected. By allocating local memory instead of allocating memory on remote core logic units, the AGP device can access the needed memory quickly without memory transmissions along the host bus, thereby increasing overall performance of the computer system.

Abstract: A computer system having a highly parallel system architecture with multiple central processing units, multiple core logic chipsets and pooled system memory is provided with one or more AGP ports capable of connection to AGP devices. A memory manager is provided within the operating system for allocating pooled memory resources without regard to the location of that memory. A method is presented for dynamically allocating memory for the AGP device that is located on the same core logic chipset to which the AGP device is connected. By allocating local memory instead of allocating memory on remote core logic units, the AGP device can access the needed memory quickly without memory transmissions along the host bus, thereby increasing overall performance of the computer system.

Abstract: A computer system having a highly parallel system architecture with multiple central processing units, multiple core logic chipsets and pooled system memory is provided with one or more AGP ports capable of connection to AGP devices. A memory manager is provided within the operating system for allocating pooled memory resources without regard to the location of that memory. A method is presented for dynamically allocating memory for the AGP device that is located on the same core logic chipset to which the AGP device is connected. By allocating local memory instead of allocating memory on remote core logic units, the AGP device can access the needed memory quickly without memory transmissions along the host bus, thereby increasing overall performance of the computer system.