Patents by Inventor John E. Thorpe

John E. Thorpe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6060666
    Abstract: A metallic foil, and a process for producing the same, having a metallic micro-layer electrodeposited on a surface of the foil, wherein the micro-layer comprises two co-deposited metals each being a metal other than the metal forming the foil, and does not change the topography of the surface on which it is deposited. The foil may be formed of copper, and the micro-layer may be formed of iron and nickel. When bonded to a polymeric substrate the peel strength of the foil is improved.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: May 9, 2000
    Assignee: Foil Technology Development Corporation
    Inventor: John E. Thorpe
  • Patent number: 5919379
    Abstract: Copper foil having a matte surface and an opposite shiny surface, the shiny surface having thereon a protective metallic coating comprised of a first protective metallic layer, preferably iron, electrodeposited on the shiny surface and a second metallic layer, preferably zinc, electrodeposited on the first layer, the metallic coating be chemically removable without damage to the copper foil and the second metallic layer being softer than the first metallic layer. The matte surface of the copper foil can be bonded to a dielectric material, and the protective metallic coating can be removed from the shiny surface by etching.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: July 6, 1999
    Assignee: Foil Technology Development Corporation
    Inventor: John E. Thorpe
  • Patent number: 4781991
    Abstract: Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used.
    Type: Grant
    Filed: October 9, 1987
    Date of Patent: November 1, 1988
    Assignee: Microclad Laminates Limited
    Inventors: John E. Thorpe, Gursharan S. Sarang
  • Patent number: 4715116
    Abstract: Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used.
    Type: Grant
    Filed: October 21, 1985
    Date of Patent: December 29, 1987
    Assignee: M&T Chemicals Inc.
    Inventors: John E. Thorpe, Gursharan S. Sarang
  • Patent number: 4112102
    Abstract: Novel derivatives of 6-(m-aminophenyl)-2,3,5,6-tetrahydroimidazo[2,1-b]thiazole(m-aminotetramis ole) having anthelmintic properties are disclosed.
    Type: Grant
    Filed: April 29, 1977
    Date of Patent: September 5, 1978
    Assignee: Pfizer Inc.
    Inventor: John E. Thorpe
  • Patent number: 4008325
    Abstract: A method of treatment or control of diseases of rice plants comprising contacting the plants, and the seeds thereof with an effective amount of a compound of the formula: ##STR1## or a non-phytotoxic acid addition salt thereof, wherein each of X and Y completes a saturated or unsaturated pyrrolo- or pyrido-ring;X and Y may each be substituted with up to two substituents selected from halo, lower alkyl, phenyl, oxo or thio;And R is hydrogen, lower akyl, lower alkoxy, lower alkanoyl, benzoyl, hydroxy, lower alkanoyloxy, cyano, or halo; andZ is hydrogen or halo.Certain of these compounds are novel compounds and are claimed as such. Compositions for the treatment of plant diseases are also claimed.
    Type: Grant
    Filed: July 25, 1975
    Date of Patent: February 15, 1977
    Assignee: Pfizer Inc.
    Inventors: Robert J. Bass, Richard C. Koch, Hugh C. Richards, John E. Thorpe