Abstract: A thermal dissipator includes an elongated laminar thermal transfer member having opposite sides, opposite ends and a longitudinal axis extending between those ends. The member has a thermal conductivity along its axis and in a first plane extending between its sides that is substantially greater than the thermal conductivity of the member in a second plane transverse to the first plane. A transverse heat sink structure contacts at least one side of the thermal transfer member along the length thereof, and extends from the thermal transfer member in a direction parallel to the first plane. A compression device compresses the thermal transfer member and the heat sink structure together to establish intimate thermal contact therebetween. Solid state lighting apparatus incorporating the dissipator is also disclosed.

Abstract: A solid state lighting device includes a relatively rigid, thermal dissipation plate with opposite sides, a printed circuit in intimate thermal contact with one side of the plate, at least one LED positioned against and electrically connected to the printed circuit and a shell having a rim secured to the one side of the plate so that the shell substantially covers the LED whereby when the LED is energized, light therefrom radiates into the shell and heat from the LED is conducted away by the plate.

Abstract: A solid state lighting device includes a thermally conductive plate having a subassembly mounted to at least one side of the plate. Each subassembly includes a mounting frame with a back side and an open center, and a PCB supporting a plurality of LEDs with electrical leads extending therefrom. The PCB is supported by the frame so that the back of the PCB is flush with the back side of the frame. A cup-like light diffuser having a rim is secured to the front of the frame so that it surrounds the frame and covers the LEDs. Fastening devices fasten the subassembly against the one side of the plate so that the back of the PCB is in intimate thermal contact with the plate and the diffuser rim abuts the plate so that when the LEDs are energized via their leads, a maximum amount of light from the LEDs is directed through the diffuser and waste heat from the LEDs is efficiently conducted away by the plate which may also constitute a reflector.

Abstract: A solid state lighting device includes a relatively rigid, thermal dissipation plate with opposite sides, a printed circuit in intimate thermal contact with one side of the plate, at least one LED positioned against and electrically connected to the printed circuit and a shell having a rim secured to the one side of the plate so that the shell substantially covers the LED whereby when the LED is energized, light therefrom radiates into the shell and heat from the LED is conducted away by the plate.

Abstract: A solid state lighting device includes a thermally conductive plate having a subassembly mounted to at least one side of the plate. Each subassembly includes a mounting frame with a back side and an open center, and a PCB supporting a plurality of LEDs with electrical leads extending therefrom. The PCB is supported by the frame so that the back of the PCB is flush with the back side of the frame. A cup-like light diffuser having a rim is secured to the front of the frame so that it surrounds the frame and covers the LEDs. Fastening devices fasten the subassembly against the one side of the plate so that the back of the PCB is in intimate thermal contact with the plate and the diffuser rim abuts the plate so that when the LEDs are energized via their leads, a maximum amount of light from the LEDs is directed through the diffuser and waste heat from the LEDs is efficiently conducted away by the plate which may also constitute a reflector.

Abstract: A thermal dissipator includes an elongated laminar thermal transfer member having opposite sides, opposite ends and a longitudinal axis extending between those ends. The member has a thermal conductivity along its axis and in a first plane extending between its sides that is substantially greater than the thermal conductivity of the member in a second plane transverse to the first plane. A transverse heat sink structure contacts at least one side of the thermal transfer member along the length thereof, and extends from the thermal transfer member in a direction parallel to the first plane. A compression device compresses the thermal transfer member and the heat sink structure together to establish intimate thermal contact therebetween. Solid state lighting apparatus incorporating the dissipator is also disclosed.

Abstract: A light source for machine vision applications includes a housing having a thermally conductive base plate which supports an array of high intensity LEDs. The LEDs are fitted with secondary lenses which are aimed such that the light beams from the LEDs illuminate fixed targets having a predetermined spatial relationship so that the light source produces a very uniform light field. After the lenses are aimed, they are secured in the desired position relative to their associated LEDs using a UV-curable adhesive.

Abstract: A solid state lighting apparatus characterized by its compact, predominately axial form factor, utilizes an axial thermal transfer member constructed of Highly Oriented Pyrolytic Graphite (HOPG) to aid in the dissipation of waste heat generated during its operation. The lighting apparatus is chiefly comprised of a Light Emitting Diode (LED) die array and circuit structure assembly affixed to one end of the axial thermal transfer member and further includes a transversely mounted heat sink structure, running the length of, and being affixed to, opposite sides of the axial member. The axial member serves to distribute waste heat down its length, and simultaneously, into a transverse plane where the waste heat is dissipated into the transversely mounted heat sink structure. A fan may be utilized to evacuate the waste heat out of the lighting apparatus and into the ambient environment.

Abstract: A solid state lighting apparatus characterized by its compact, predominately axial form factor, utilizes an axial thermal transfer member constructed of Highly Oriented Pyrolytic Graphite (HOPG) to aid in the dissipation of waste heat generated during its operation. The lighting apparatus is chiefly comprised of a Light Emitting Diode (LED) die array and circuit structure assembly affixed to one end of the axial thermal transfer member and further includes a transversely mounted heat sink structure, running the length of, and being affixed to, opposite sides of the axial member. The axial member serves to distribute waste heat down its length, and simultaneously, into a transverse plane where the waste heat is dissipated into the transversely mounted heat sink structure. A fan may be utilized to evacuate the waste heat out of the lighting apparatus and into the ambient environment.

Abstract: A forced air cooling unit for a light source formed of an array of high intensity light emitting diodes (LEDs). A housing includes side walls with a pair of grooves on the inside of the walls. A heat sink includes side extensions which are slidably received in the grooves. The LED array is mounted in thermal contact with the heat sink so as to protrude from the top of the housing. The housing side walls include a second pair of inside grooves below the first pair. The second pair of grooves slidably receive a cooling fan base plate. An internal air flow chamber thus defined by the housing side walls, the base plate and the heat sink. A cooling fan, mounted at one end of the base plate, draws cooling air into internal chamber. The air flows by the heat sink, carrying with it heat generated by the LEDs, to the other opposite end of the base plate, where it exits the internal chamber through openings in the base plate.

Abstract: A solid state lighting apparatus utilizes a thermally conductive membrane with Light Emitting Diode (LED) die arrays on opposite sides of the membrane as well as a reflecting optical system straddling the thermal membrane and enveloping the LED arrays. The thermal membrane is comprised of a sheet of anisotropic annealed pyrolytic graphite with a central copper via and outer copper frame. These components, after being assembled preliminarily, are plated in copper, or first in copper and then in nickel, as a whole, to provide structural integrity and improved thermal conductivity between the components. The optical system is comprised of a first-surface reflector, either a surface of revolution or compound shape, with foci of reflection that are aligned with the LED arrays on either side of the thermal membrane. Thermal dissipation structures are clamped or bonded to the thermal membrane's outer frame to remove heat from the device.

Abstract: The system includes a circuit board on which electrical components are mounted. The components are mounted on the front side of the board, and the back side of the board is thermally coupled to the housing by a liquid-filled thermal heat sink pouch between the board and the housing. A heat generating component such as a microprocessor is mounted to the front side of the board, but the top surface of the component is directed toward the back side of the board such that it is also thermally coupled to the housing.

Abstract: A microcomputer system includes a microprocessor and a housing for holding the microprocessor. The housing includes sets of conectors preferably comprised of two alternative sets of connectors. The microcomputer system is light weight, small and portable. Connections to external components such as peripheral devices are achieved with one embodiment via a docking connector. This docking connector includes a set of pin connectors that can be coupled to connectors on the housing. It also includes an ejector mechanism. The ejector mechanism enables decoupling by depression of the ejector. The use of the docking connector allows all peripheral connections to be realized through a single connector.