Abstract: A conductive contact for use with metal oxide superconductors is described. The conductive contact comprises a metal contact which is attached by a diffusion bonding means to a superconductive metal oxide substrate. In a preferred embodiment, diffusion bonding means comprises a metal paint which includes metal particles and an organic binder which is heated to pyrolized the organic binder and form metallic diffusion bonds to the metal contact and metal oxide substrate. The invention also comprises a method for forming the conductive contact which includes selecting the superconducting metal oxide substrate, coating the substrate with a metal paint, placing the metal contact in touching contact with the metal paint and heating the combination of materials described above to pyrolized the organic binder and coalesce the metal particles.