Patents by Inventor John E. Tyler

John E. Tyler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for breaking semiconductor wafers
    Patent number: 7262115
    Abstract: An apparatus and method for breaking a semiconductor wafer along scribe lines to separate individual die. A scribe line of the wafer is aligned with a straight, elongated pyramid-shaped edge of a precision bending bar, and a compressive force is applied to the surface of the wafer by a compressive member to bend the wafer over the edge and break the wafer along the scribe line.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: August 28, 2007
    Assignee: Dynatex International
    Inventors: William H. Baylis, John E. Tyler
  • Coating composition and method
    Patent number: 4645715
    Abstract: Coatings and methods for forming same are provided. Generally, the coatings are wear resistant disordered coatings of at least one nonmetallic element and a transition metal that are deposited on an article surface, such as a tool surface or other surface that is subjected to wear or friction. The resulting tools generally exhibit increased life with excellent lubricity thereby improving the surface finish of workpieces machined therewith.Adherence coatings are provided for achieving improved adherence of the wear resistant coating to the substrate.
    Type: Grant
    Filed: March 17, 1982
    Date of Patent: February 24, 1987
    Assignee: Energy Conversion Devices, Inc.
    Inventors: Stanford R. Ovshinsky, John E. Keem, James D. Flasck, Richard C. Bergeron, John E. Tyler